SCDF103_15 Datasheet, PDF (1/2 Pages) SeCoS Halbleitertechnologie GmbH – 1.0 Amp Glass Passivated Fast Recovery Rectifier

Elektronische Bauelemente
SCDF103~SCDF107
Voltage 200 V ~ 1000 V
1.0 Amp Glass Passivated Fast Recovery Rectifier
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
FEATURES
 Lead free product, compliance to RoHS
 GPRC (Glass passivated rectifier chip) inside
 Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
BC
MECHANICAL DATA
 Case : Packed with FRP substrate and epoxy underfilled
 Terminals : Pure Tin plated (Lead-Free), solderable
per MIL-STD-750, Method 2026.
 Weight : 0.012 gram
E
MARKING
1206
A
G
F
Cathode Band
E
PACKAGE INFORMATION
Package
MPQ
1206
3K
Leader Size
13’ inch
D
REF.
A
B
C
D
Millimeter
Min. Max.
3.20 3.60
1.70 2.10
1.60 TYP.
0.86 1.16
REF.
E
F
G
Millimeter
Min. Max.
0.50 0.90
R 0.40
0.05 REF.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(Rating 25°C ambient temperature unless otherwise specified. Single phase half wave, 60Hz, resistive or inductive load.
For capacitive load, de-rate current by 20%.)
Parameter
Symbol
Part Number
Unit
SCDF103 SCDF104 SCDF105 SCDF106 SCDF107
Maximum Repetitive Peak Reverse Voltage
V_RRM
200
400
600
800
1000
V
Maximum DC Blocking Voltage
V_DC
200
400
600
800
1000
V
Maximum Average Forward
I_F(AV)
1
A
Peak Forward Surge Current, 8.3ms single half
sine-wave superimposed on rated load
I_FSM
30
A
Maximum Instantaneous Forward Voltage @ 1A
V_F
1.3
V
Maximum Repetitive peak
reverse current
T_A=25°C
T_A=125°C
I_RRM
Maximum Reverse Recovery Time ¹
T_RR
Typical Thermal Resistance³
R_θJC
Typical Thermal Resistance³
R_θJA
Typical Thermal Resistance^3.4
R_θJL
Typical Junction Capacitance ²
C_J
1
30
250
40
130
40
15
μA
300
nS
°C/W
°C/W
°C/W
pF
Operating & Storage Temperature
T_J,T_STG
-50~125, -65~150
°C
Notes:
1. Reverse Recovery Time test condition：I_F=0.5A, I_R=1A, I_RR=0.25A
2. Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3. Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas.
4. The thermal resistance in measured over the centered point of the copper pad.
5. Preliminary draft
http://www.SeCoSGmbH.com/
19-Apr-2013 Rev.C
Any changes of specification will not be informed individually.
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