MMBD4448DW_15 Datasheet, PDF (1/2 Pages) SeCoS Halbleitertechnologie GmbH – Surface Mount Switching Diode Array

Elektronische Bauelemente
MMBD4448DW
Surface Mount Switching Diode Array
FEATURES
RoHS Compliant Product
A suffix of "-C" specifies halogen & lead-free
SOT-363
· Fast Switching Speed
· Ultra-Small Surface Mount Package
· High Conductance Power dissipation
MECHANICAL DATA
.055(1.40)
.047(1.20)
.026TYP
(0.65TYP)
.021REF
(0.525)REF
· Case: SOT-363, Molded Plastic
· Terminals: Solderable per MIL-STD-202,
Method 208
· Polarity: See Diagrams Below
· Weight: 0.006 grams (approx.)
· Mounting Position: Any
4
5
6
O
3
2
1
.096(2.45)
.085(2.15)
.014(0.35)
.006(0.15)
.087(2.20)
.079(2.00)
.018(0.46)
.010(0.26)
6
5
4
.043(1.10)
.035(0.90)
8^o
0^o
.053(1.35)
.045(1.15)
.006(0.15)
.003(0.08)
.004(0.10)
.000(0.00)
.039(1.00)
.035(0.90)
1
2
3
MMBD4448 DW Marking: KA3
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
RMS Reverse Voltage
Average Rectified out Current(Note 1)
Forward Continuous Current (Note 1)
Thermal Resistance Junction to Ambient Air (Note1)
Storage Temperature Range
V_RM
V_RRM
V_R(RMS)
Io
I_FM
R _thJA
Tstg
100
75
53
250
500
625
– 55 to +150
V
V
V
mA
mA
°C/W
°C
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (EACH DIODE)
Characteristic
Symbol
Reverse Breakdown Voltage (Note 2)
Forward Voltage (Note 2)
IF=5.0mA
V(BR)R
IF=10mA
VF
IF=50mA
IF=150mA
Reverse Current (Note 2)
VR=75V
VR=75V, Tj=150^OC
VR=25V, Tj=150^OC
IR
VR=20V
Total Capacitance VR=0, f=1.0MHz
CT
Reverse Recovery Time IF=IR=10mA, Irr=0.1XIR,RL=100 Ohms
t _rr
Min
75
0.62
—
—
—
—
—
—
—
—
—
Max
Unit
—
V
0.72
0.855
1.0
V
1.25
2.5
uA
50
uA
30
uA
25
nA
4.0
pF
4.0
nS
Note 2. Short duration test pulse used to minimize self-heating.
http://www.SeCoSGmbH.com
01-Jan-2006 Rev.B
Any changing of specification will not be informed individual
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