MB08M_15 Datasheet, PDF (1/2 Pages) SeCoS Halbleitertechnologie GmbH – Miniature SMD Glass Passivated Bridge Rectifiers

Elektronische Bauelemente
MB08M
1000V 0.8 Amp
Miniature SMD Glass Passivated Bridge Rectifiers
RoHS compliant product
A suffix of “-C” specifies halogen & lead-free
FEATURES
Halogen-free type
Glass passivated chip junctions
Compliance to RoHS product
Leadless chip form, no lead damage
Low power loss, High efficiency
High current capability
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
APPLICATION
AC/DC Power Supply
Communication Equipment
Lighting
MECHANICAL DATA
Case : Packed with FRP substrate and epoxy underfilled
Terminals : Pure Tin plated (Lead-Free),
solderable per MIL-STD-750, Method 2026
MARKING
M
PACKAGE INFORMATION
Package
MPQ
MBCN
5K
Leader Size
13 inch
MBCN
REF.
A
B
C
Millimeter
Min. Max.
3.40 3.60
3.70 3.90
2.44 2.64
REF.
D
E
F
Millimeter
Min. Max.
2.00 2.35
0.60 0.80
0.95 1.35
ABSOLUTE MAXIMUM RATINGS ( TA=25℃unless otherwise specified)
Parameters
Symbol
Repetitive peak reverse voltage
Average Forward Current
on glass-epoxy P.C.B. ¹
on aluminum substrate ²
Peak forward surge current, 8.3ms single half sine-wave
Operating and Storage temperature range
VRRM
IF(AV)
IFSM
TJ, TSTG
Rating
1000
0.5
0.8
30
-55 ~ 150
Unit
V
A
A
℃
ELECTRICAL CHARACTERISTICS (at T_A=25℃unless otherwise specified)
Parameters
Symbol
Min.
Typ.
Max.
Unit
Forward Voltage at IF = 0.4A
VF
-
0.9
1
Repetitive peak reverse ^TA^=25°C
-
current@ VR = Max. VRRM _TA=125°C
IRRM
-
0.08
5
-
100
Current squared time t < 8.3ms
I²t
-
3.74
-
Thermal Resistance Junction to Ambient ¹
RθJA
-
Thermal Resistance Junction to Lead ¹
RθJL
-
130
-
40
-
Note:
1.
2.
3.
On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3 x 1.3 mm) solder pads.
On aluminum substrate P.C.B. with an area of 0.8 x 0.8" (20 x 20 mm) mounted on 0.05" x 0.05" (1.3 x 13. mm) solder pads.
Preliminary specification.
V
uA
A²s
℃/W
http://www.SeCoSGmbH.com/
27-Sep-2013 Rev. A
Any changes of specification will not be informed individually.
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