UMT-H_15 Datasheet, PDF (1/3 Pages) Schurter Inc. – Surface Mount Fuse, 5.3 x 16 mm, Time-Lag T, 277 VAC / 250 VDC, Breaking Capacity 1500 A

Non resettable fuses
www.schurter.com/PG01_2
Surface Mount Fuse, 5.3 x 16 mm, Time-Lag T, 277 VAC / 250 VDC, Breaking Capacity 1500 A
UMT-H
UL 248-14 · 277 VAC · 250 VDC · Time-Lag T
Description
- 21 rated currents from 160 mA to 16 A
- Square design: 5.3 x 16
- Impermeable to potting compound used to achieve hermetic seal for
use in intrinsically safe applications according to ATEx and IECEx re-
quirements.
Unique Selling Proposition
- High breaking capacity of 1500 A
- High rated voltages up to 277 VAC / 250 VDC
- Compact design
Standards
- IEC 60127-7
- UL 248-14
- CSA C22.2
Approvals
- VDE Certificate Number: 40039476
- UL File Number: E41599
Technical Data
Rated Voltage
Rated current
250 - 277 VAC, 125 - 250 VDC
0.16 - 16 A
Breaking Capacity
Characteristic
1500 A
Time-Lag T
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
PCB,SMT
-55 °C to 125 °C
55/125/21 acc. to IEC 60068-1
Ceramic
Ni/Sn-Plated Copper Alloy
Unit Weight
Storage Conditions
1.42 g
0 °C to 40 °C, max. 70% r.h.
Product Marking
, Rated current, Voltage, Characteri-
stic, Breaking Capacity, Approvals
Dimension
Applications
- Primary protection on SMD PCBs
- Industrial electronic
- Sensors
- Power supplies
- Explosion protection
- Lighting
References
Packaging Details
Fuse Kit  Fuse Kit UMT-H
Weblinks
pdf-datasheet, html-datasheet, General Product Information, Approvals,
CE declaration of conformity, RoHS, CHINA-RoHS, REACH, e-Shop,
SCHURTER-Stock-Check, Distributor-Stock-Check, Detailed request for
product, Video
Soldering Methods
Solderability
Resistance to Soldering Heat
Life Test
Moisture Resistance Test
Terminal Strength
Mechanical Shock
Resistance to Solvents
Reflow
Soldering Profile
245 °C / 3 sec acc. to IEC 60068-2-58
260 °C / 10 sec acc. to IEC 60068-2-58
1000h @ 0.60 x In @ 70°C
(acc. to EIA/IS-722, Test 4.4.1)
MIL-STD-202, Method 106E
(acc. to EIA/IS-722, Test 4.4.3)
(Deflection of board 1 mm for 1 minute)
(acc. to EIA/IS-722, Test 4.5.5)
MIL-STD-202, Method 213B
(Shock 50g, half sine wave, 11 ms)
MIL-STD-202, Method 215A
(EIA-722, 4.11)
3.2 >10 2.8 0.4
15.4 ^±0.20
R0.35
Ø 2.25
R ^0.7
5.35 ^±0.05
Soldering pads
10
3.75
Fuses
1