OMT_16 Datasheet, PDF (1/3 Pages) Schurter Inc. – Surface Mount Fuse, 11 x 4.6 mm, Time-Lag T, 250 VAC, 125 VDC

Non resettable fuses
www.schurter.com /PG01_2
Surface Mount Fuse, 11 x 4.6 mm, Time-Lag T, 250 VAC, 125 VDC
OMT
Exemplary part photo depending on
part no.
UL 248-14 · 250 VAC · 125 VDC · Time-Lag T
Description
- Directly solderable on printed circuit boards
Standards
- UL 248-14
- CSA C22.2 no. 248.14
Approvals
- UL File Number: E41599
- CSA File Number: 51172
Technical Data
Rated Voltage
Rated current
Breaking Capacity
125 - 250 VAC, 125 VDC 
0.75 - 5 A
50 A - 100 A
Characteristic
Mounting
Time-Lag T
PCB,SMT
Admissible Ambient Air Temp. -40 °C to 125 °C
Climatic Category
40/125/21 acc. to IEC 60068-1
Material: Housing
Material: Terminals
Thermoplastic, UL 94V-0
Tin-Plated Copper Alloy
Unit Weight
Storage Conditions
0.04 g
0 °C to 40 °C, max. 70% r.h.
Product Marking
, Type, Rated current, Approvals
Dimension
11 mm
Applications
- Primary protection on SMD PCBs
- AC and DC applications
References
Packaging Details
Weblinks
pdf-datasheet, html-datasheet, General Product Information, Packaging
details, Approvals, CE declaration of conformity, RoHS, CHINA-RoHS,
REACH, Distributor-Stock-Check, Detailed request for product
Soldering Methods
Solderability
Resistance to Soldering Heat
Moisture Resistance Test
Terminal Strength
Thermal Shock
Case Resistance
Mechanical Shock
Vibration, High Frequency
Resistance to Solvents
Reflow, Wave
Soldering Profile
245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
260 °C / 10 sec acc. to IEC 60068-2-58,
Test Td
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
(Deflection of board 1 mm for 1 minute)
MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to
+125°C)
acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
MIL-STD-202, Method 213B
(Shock 50g, half sine wave, 11 ms)
MIL-STD-202, Method 204D
Shock 20 gn, 20 min, 10-2 kHz, 12 cyc.
MIL-STD-202, Method 215A
11
1.75
7.5
4.6
5.5 2.2
3.2
3.6 6
Soldering pads
Fuses
1