20400609 Datasheet, PDF (1/3 Pages) Schurter Inc. – Subminiature Fuse, 8.5 mm, Time-Lag T, Telecom

Telecom Fuses
Subminiature Fuse, 8.5 mm, Time-Lag T, Telecom
MSU 250
www.schurter.com/pg01_3
IEC 60127-3 · 250 VAC · Time-Lag T
Standards
- IEC 60127-3/4
- UL 248-14
- CSA C22.2 no. 248.14
- Telcordia GR-1089
- UL 60950 / IEC 60950
- ITU-T K.20 and K.21
- TIA-968-A
Approvals
- VDE License Number: 40013529
- UL File Number: E41599
Technical Data
Rated Voltage
Rated Current
Breaking Capacity
Characteristic
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
250 VAC
0.25 - 3.15 A
35 A
Time-Lag T
PCB,THT
-40 °C to 85 °C
40/085/21 acc. to IEC 60068-1
Thermoplastic, UL 94V-0
Tin-Plated Copper
0.5 g
0 °C to 60 °C, max. 70% r.h.
, Type, Current, Voltage, Characteri-
stic, Approvals
Dimensions
8.5 mm
Applications
- xDSL and ADSL linecards and modems
References
General Product Information
Packaging Details
Corresponding Fuseholder   FMS (250V)
Weblinks
Approvals, RoHS, CHINA-RoHS, e-Store, Distributor-Stock-Check,
Accessories, Product Change Notification (PCN)
Soldering Methods
Solderability
Resistance to Soldering Heat
Current Carrying Capacity
Moisture Resistance Test
Terminal Strength
Case Resistance
Mechanical Shock
Vibration, High Frequency
Resistance to Solvents
Flammability
Wave, Iron
235 °C / 2 sec acc. to IEC 60068-2-20,
Test Ta, method 1
260 °C / 5 sec acc. to IEC 60068-2-20,
Test Tb, method 1A
acc. to EIA/IS-722, Test 4.3.3
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
(Deflection of board 1 mm for 1 minute)
acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
MIL-STD-202, Method 213B
(Shock 50gn, half sine wave, 11 ms)
MIL-STD-202, Method 204D
(Shock 20 gn, 20 min, 10-2 kHz, 12
cyc.)
MIL-STD-202, Method 215A
min. UL 94V-1
(acc. to EIA/IS-722, Test 4.12)
ø 8.5
ø 8.5
3.2
ø 0.64
5.08
3.2
ø 0.64
5.08
Drilling diagram
+0.1
10
5.08
Fuses