0034.5612.11 Datasheet, PDF (1/3 Pages) Schurter Inc. – Directly solderable on printed circuit boards

Non resettable fuses
Surface Mount Fuse, 5 x 20 mm, Time-Lag T, L, 250 VAC, Au plating
SMD-FST
www.schurter.com/pg01_2
IEC 60127-2 · 250 VAC · Time-Lag T
Description
- Directly solderable on printed circuit boards
- L = Low Breaking Capacity
- For rated current 1 A to 16 A, SMD-SPT is recommended
Standards
- IEC 60127-2/3
- UL 248-14
- CSA C22.2 no. 248.14
Approvals
- VDE Certificate Number: 40011522
- UL File Number: E41599
Technical Data
Rated Voltage
Rated Current
Breaking Capacity
Characteristic
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
250 VAC
0.05 - 20 A
35 A - 125 A
Time-Lag T
PCB,SMT
-55 °C to 125 °C
55/125/21 acc. to IEC 60068-1
Glass
Gold-Plated Copper Alloy
1.05 g
0 °C to 60 °C, max. 70% r.h.
, Current, Dielectric strength, Cha-
racteristic, Breaking Capacity
Dimensions
20 mm
Applications
- Primary Protection on SMD PCB
References
Packaging Details
Weblinks
pdf-datasheet, html-datasheet, General Product Information,
Approvals, CE declaration of conformity, RoHS, CHINA-RoHS, e-Shop,
SCHURTER-Stock-Check, Distributor-Stock-Check, Detailed request for
product
Soldering Methods
Solderability
Resistance to Soldering Heat
Resistance to Vibration
Load Humidity Test
Moisture Resistance Test
Terminal Strength
Thermal Shock
Case Resistance
Resistance to Solvents
Reflow
245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
260 °C / 10 sec acc. to IEC 60068-2-58,
Test Td
acc. to IEC 60068-2-6, test Fc
MIL-STD-202, Method 103B
0.1 x In @ 0.85 r.H. @ 85°C
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
Deflection of board 1 mm for 1 minute
MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to
+125°C)
acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
MIL-STD-202, Method 215A
10 ^±0.2
20 ^±0.5
5.5 9.5 5.5
Soldering pads
Fuses