LC9948G Datasheet, PDF (9/10 Pages) Sanyo Semicon Device – 1/5 Optical Size CCIR B/W Solid-State Image Sensor

LC9948G
Notes on Mounting and Handling
1. Preventing Electrostatic Discharge (ESD)
Since CCD sensors are easily destroyed by ESD, the antistatic measures described below should be employed when
handling this device.
• All tools and personnel must be grounded when handling CCDs. Note that a 1 MΩ resistor should be inserted in
series between personnel and ground for safety. (We recommend using wrist straps for personnel grounding.)
• Personnel should handle CCD devices with either bare hands or antistatic gloves. Use antistatic materials for work
garments. Personnel should wear conductive shoes.
• Lay conductive mats on the floor and benches in the workplace so that static charges do not accumulate.
• We recommend using ionized air blowers (or other static removal techniques) when mounting CCD sensors.
• Use antistatic boxes when transporting boards that have CCD sensors mounted on them.
• Do not leave packing materials or fittings made from plastic materials (such as Styrofoam) that easily collect static
charges on or near workplace tables.
• Ground all tools, test equipment, conveyors, soldering irons, and other objects used in the workplace. Inspect
grounding regularly to assure that it is complete.
• Do not handle this IC in the vicinity of TV monitors or other equipment that generates high static voltages. If
unavoidable, install antistatic filters in front of monitor screens and take all other possible antistatic measures.
• Static charges accumulate easily in workplaces with a low relative humidity. Manufacturing operations should be
carried out in an environment with a relative humidity of at least 50%.
2. Soldering
• This IC’s package temperature must not exceed 80°C.
• Since CCD sensors are sensitive to thermal stress as well as ESD, the soldering iron temperature should be under
300°C. Aim for a soldering time of 2 seconds per pin.
• Use soldering irons that include an adjustable temperature control function that holds the soldering iron tip at a
constant temperature.
• Be especially careful to assure that the device package temperature does not exceed 80°C when repairing or
redoing solder joints or removing a CCD sensor from a printed circuit board.
3. Soiling and Contamination Prevention
• CCD sensors should be handled in a clean workplace. (A class 1000 level is appropriate.)
• Do not touch the package surface and do not allow any object to contact the package surface. Use compressed air
to remove any foreign object (such as dust) that lands on the package surface. (We recommend using an ionized air
blower if possible.)
• Use a cotton swab dipped in ethyl alcohol to remove oily contamination, being especially careful not to scratch the
package surface.
• Use special-purpose cases to prevent soiling and contamination. Warm or cool CCD sensors in advance to prevent
condensation when transporting between rooms with radically differing temperatures.
• For CCD sensors that are shipped with protective tape applied, only remove that tape immediately prior to use in
an environment in which ESD prevention measures have been fully implemented. Do not reuse protective tape that
has been removed from a CCD sensor.
4. Storage
• Do not allow sunlight or other bright light to fall on CCD sensors for extended periods.
• Since harsh conditions such as high temperatures or high humidities can adversely influence device characteristics,
do not use or store these devices in environments with such conditions. Samples should be stored in places where
the temperature and humidity fall in normal ranges, i.e., 5 to 35°C and 45 to 75% RH.
• Since CCD sensors are precision optical components, do not apply mechanical shocks.
• Avoid locations with corrosive atmospheres or high dust levels.
• Avoid locations subject to rapid temperature changes.
• Do not place heavy objects on top of boxes containing CCD sensors during storage.
• Use materials that cannot accumulate static charges for containers used to hold samples.
• Do not apply mechanical shocks to magazines holding CCD sensors, since this could adversely influence reliability
during mounting.
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