SLP-4130C-81 Datasheet, PDF (3/4 Pages) Sanyo Semicon Device – ø5mm yellow contact type LED lamp

SLP-4130C-81
PRECAUTIONS
(1) Bending a lead should avoid not to cause chip deterioration or so. When bending is necessary, care must be taken
considering the following points :
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing a lead tight and applying no stress on the resin part; otherwise it
may cause troubles such as gold wire breaking.
e A lead must be bent at intervals of 1.6mm from the edge of the resin part.
r Do not bend the same portion of lead more than twice.
(2) Setting a product by a tool such as holder should avoid. When necessary, no stress should be applied to the resin part and
lead by sufficient considerations on dimension tolerance, thermal expansion, thermal contraction of holder, product and
circuit board.
(3) The hole pitch of a circuit board must fit to its lead pitch.
(4) When soldering, care must be taken considering the following points :
q Do not heat a product under any stress (ex. : twist) to leads.
w Do not heat (by soldering, for example) a product in the states of being forced to the resin part.
(5) Do not use the flux containing chlorine which may cause corrosion of lead and washing is preferable. When washing is
necessary, avoid washing the whole product and wash only the needed part under the following conditions.
• Chemicals : Methyl alcohol
• Temperature : 45°C max.
• Time : 30sec. max.
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