LA4485 Datasheet, PDF (3/20 Pages) Sanyo Semicon Device – 5 W, Two-channel Power Amplifier with Very Few External Parts

LA4485
Recommended LA4485 External Parts Arrangement (Dual-mode)
IC Usage Notes
95.0 × 67.0 mm²
Maximum ratings
Care must be taken when operating the LA4485 close to the maximum ratings as small changes in the operating conditions can
cause the maximum ratings to be exceeded, thereby breakdown will be caused.
Printed circuit board connections
Care must be taken when designing the circuit of printed board so as not to form feedback loops, particularly with the small-signal
and large-signal ground connections.
Notes on LA4485 heatsink mounting
1. Mounting torque must be in the range 39 to 59 Nvcm.
2. The spacing of the tapped holes in the heatsink must match the spacing of the holes in the IC tab.
3. Use screws with heads equivalent to truss head machine screws and binding head machine screws stipulated by JIS for the
mounting screws. Furthermore, washers must be used to protect the surface of the IC tab.
4. Make sure that there is no foreign matter, such as cutting debris, between the IC tab and the heatsink. If a heat conducting
compound is applied between the contact surfaces, make sure that it is spread uniformly over the entire surface.
5. Because the heatsink mounting tab and the heatsink are at the same electric potential as the chip’s GND (large signal GND),
care must be taken when mounting the heatsink on more than one device.
6. The heatsink must be mounted before soldering the pins to the PCB.
Comparison of External Parts Required
External parts
Output coupling capacitors
Input coupling capacitors
Bootstrap capacitors
Feedback capacitors
Filter capacitor
Phase compensating capacitor
Oscillation-quenching mylar capacitors
Oscillation-quenching resistors
Others
Total (for dual-mode)
Existing device
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
15 to 16 parts
LA4485
Yes
Yes
No
No
Optional
No
No
No
Optional
4 to 6 parts
Note: Supply capacitors, contained within the power IC, are not counted in both existing and new devices.
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