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| LA1652C Datasheet, PDF (3/5 Pages) Sanyo Semicon Device – Monolithic Linear IC Time Code Reception IC | |||
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Chip Specifications
Parameter
Chip size
Chip thickness
Pad size
Pad opening
LA1652C
Conditions
Ratings
1.73Ã2.60
330(±20)
140Ã140
115Ã115
Unit
mm2
µm
µm2
µm2
PAD Coordinates
PAD
P1
X-Axis
664
Y-Axis
150 P9
PAD
X-Axis
1293
Y-Axis
2450
P2
180
180 P10
1580
2330
P3A
150
864 P11
1580
2103
P3B
150
372 P12
1580
1754
P4
150
1034 P13
1580
1360
P5
150
1563 P14
1580
1108
P6A
150
2269 P15
1570
160
P6B
150
1733 P16
974
150
P7
160
2440
P8
876
2450
Notes
1. The left upper corner of the Pad Layout Diagram on the following page is the origin, the X axis increases to the right
and the Y axis increases in the downward direction.
2. Units : µm
3. The pad coordinates give the coordinate values of the center of the pads.
4. Both of each of the pairs P3A/P3B (VCC) and P6A/P6B (ground) must be bonded.
No.A0207-3/5
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