QTS-025-01-L-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH-SPEED GROUND PLANE HEADER

F-217
QTS–025–01–L–D–A
®
QTS–075–01–F–D–A
QTS–050–01–F–D–A
(0.635 mm) .025"
QTS SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
1.8 A per pin
(1 pin powered per row)
Ground Plane:
23.1 A per ground plane
(1 ground plane powered)
Operating Temp:
-55 °C to +125 °C
Voltage Rating:
285 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSS
Cable Mates:
SQCD
Standoffs:
SO
Integral metal plane
for power or ground
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
HIGH-SPEED CHANNEL PERFORMANCE
QTS/QSS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [e-mail]
25
Gbps
(0.635 mm)
.025"
pitch
Alignment
Pin
Polarized
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (025-075)
Board Stacking:
For applications requiring more
than two connectors per board
contact [e-mail]
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594 FILE NO: 090871_0_000
ALSO AVAILABLE
(MOQ Required)
• 11 mm & 16 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
Contact Samtec.
Note: Some lengths, styles
and options are non-standard,
non-returnable.
QTS
NO. OF POSITIONS
PER ROW
LEAD
STYLE
PLATING
OPTION
D
A
OTHER
OPTION
–025, –050, –075
(50 total positions per bank)
Specify
LEAD
STYLE
from
chart.
(No. of Positions per Row/25) x (20.00) .7875
(20.00) .7875
01
(5.97)
.235
(7.11)
.280
02
(0.635) .025
(0.20) .008
–F
= Gold Flash on Signal Pins
and Ground Plane,
Matte Tin on tails
–L
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane,
Matte Tin on tails
– C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min Au over
50 µ" (1.27 µm) Ni on Ground
Plane in contact area,
Matte Tin over 50 µ" (1.27 µm)
min Ni on all solder tails
*Note: –C Plating passes
10 year MFG testing
–K
= (7.00 mm)
.275" DIA
Polyimide film
Pick &
Place Pad
–TR
= Tape & Reel
LEAD
STYLE
A
MATED
HEIGHT
(0.76)
–01 (4.27) .168 (5.00) .197
A
.030
–02 (7.26) .286 (8.00) .315
(0.89)
.035
DIA
Processing conditions will affect
mated height. See SO Series
for board space tolerances
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.