QTH-060-07-L-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH SPEED GROUND PLANE HEADER

F-211-1
QTH–090–01–C–D–A
®
(0,50mm) .0197"
QTH SERIES
QTH–060–07–F–D–A
QTH–030–01–L–D–A–RT1
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact [e-mail]
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm and
30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Integral metal plane for
Standard
Board Mates:
QSH
Cable Mates:
HFHM2, HQCD,
power or ground
®
Stack
Heights
from 5mm
to 25mm
• Retention pin
option
HQDP
(See Application
Specific note)
finalinch.com
TM
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EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSH
5mm Stack Height
Type Rated @ 3dB Insertion Loss
Single-Ended Signaling –D
9 GHz / 18 Gbps
Differential Pair Signaling –D
8 GHz / 16 Gbps
Differential Pair Signaling –DP
9.5 GHz / 19 Gbps
Performance data for other stack heights and complete
test data available at www.samtec.com?QTH or contact
[e-mail]
Polarized
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
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QTH
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE _A
OTHER
OPTION
–030, –060, –090, –120
(60 total pins per bank = –D)
–020, –040, –060, –080
(20 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–D = (No. of Pins per Row/30) x (20,00) .7875
–DP = (No. of Pairs per Row/20) x (20,00) .7875
(20,00) .7875
01
–F
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
–L
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
(7,11)
.280
02
(0,50)
.0197
(0,20)
.008
–01 & –02
(0,76) ^{(3,30) .130}
.030
–03 thru –07
(1,57)
.062
–C*
= Electro-Polished
Selective
50µ" (1,27µm) min Au
over 150µ" (3,81µm)
Ni on Signal Pins
in contact area,
10µ" (0,25µm) min Au
over 50µ" (1,27µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27µm) min Ni
on all solder tails
(0,89)
.035
DIA
(1,57)
.062
DIA _–RT1
(0,64)
.025
–L
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
–K
= (7,00mm)
.275" DIA
Polyimide film
Pick &
Place Pad
(N/A with -05 &
-07 lead style)
– TR
= Tape & Reel
(–090 positions
maximum)
QTH
HEIGHT
LEAD A WITH
STYLE
QSH*
–01
(4,27) (5,00)
.168 .197
–02
(7,26)
.286
(8,00)
.315
–03
(10,27) (11,00)
.404 .433
–04
(15,25) (16,00)
.600 .630
–05
(18,26) (19,00)
.718 .748
–07
(24,24) (25,00)
.954 .984
*Processing conditions
will affect mated height.
– RT1
= Retention
Option
(–01 lead style
only & –090
positions
maximum)
–L
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP),
–080, –090
& –120 or
–RT1 option)
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