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QTH-040-01-L-D-DP-A Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH-SPEED GROUND PLANE HEADER | |||
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F-217
QTHâ090â01âCâDâA
®
(0.50 mm) .0197"
QTHâ060â07âFâDâA
QTHâ030â01âLâDâA
QTH SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Board Mates:
QSH
Cable Mates:
HQCD, HQDP
(See Also Available Note)
Standoffs:
SO
Integral metal plane for
power or ground
HIGH-SPEED CHANNEL PERFORMANCE
QTH/QSH @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
25
Gbps
Standard Stack Heights
from 5 mm to 25 mm
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
PROCESSING
LeadâFree Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (030-060)
(0.15 mm) .006" max (090)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594 FILE NO: 090871_0_000
PROTOCOLS
⢠100 GbE
⢠Hypertransportâ¢
⢠XAUI
⢠PCI Express®
⢠SATA
⢠InfiniBandâ¢
ALSO AVAILABLE
(MOQ Required)
⢠15 mm, 22 mm and
30 mm stack height
⢠30 µ" (0.76 µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
⢠Edge Mount & Guide Posts
⢠80 (-DP), 120, 150
positions per row
⢠Retention Option
Contact Samtec.
QTH
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE A
OTHER
OPTION
â030, â060, â090
(60 total pins per bank = âD)
â020, â040, â060
(20 pairs per bank = âDâDP)
Specify
LEAD
STYLE
from
chart
âD = (No. of Pins per Row/30) x (20.00) .7875
âDP = (No. of Pairs per Row/20) x (20.00) .7875
(20.00) .7875
01
(7.11)
.280
02
(0.50)
.0197
(0.20)
.008
â01 & â02
â03 thru â09
âF
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
âL
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
âC*
= Electro-Polished
Selective
50 µ" (1.27 µm) min Au
over 150 µ" (3.81 µm)
Ni on Signal Pins in
contact area,
10 µ" (0.25 µm) min Au
over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50 µ"
(1.27 µm) min Ni
on all solder tails
(0.76)
.030
*Note: âC Plating passes
10 year MFG testing
âD
= Single-Ended
âDâDP
= Differential Pair
(â01 only)
QTH
HEIGHT
LEAD A WITH
STYLE
QSH*
â01
(4.27)
.168
(5.00)
.197
â02
(7.26)
.286
(8.00)
.315
â03
(10.27) (11.00)
.404 .433
â04
(15.25) (16.00)
.600 .630
â05
(18.26) (19.00)
.718 .748
â07
(24.24) (25.00)
.954 .984
â09
(13.26) (14.00)
.522 .551
*Processing conditions
will affect mated height.
See SO Series for
board space tolerances
âK
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
(N/A with -05 &
-07 lead style)
â TR
= Tape & Reel
(â090 positions
maximum)
âL
= Latching
Option
(â01 lead
style only)
(N/A on
â060 (âDâDP)
& â090)
(0.89)
.035
DIA
(0.64)
.025
âL
Note: Some lengths, styles
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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