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QTH-030-01-L-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH SPEED GROUND PLANE HEADER | |||
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F-214
QTHâ090â01âCâDâA
®
(0,50 mm) .0197"
QTHâ060â07âFâDâA
QTHâ030â01âLâDâA
QTH SERIES
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete speciï¬cations and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating: Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Processing:
LeadâFree Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (030-060)
(0,15 mm) .006" max (090)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
Board Mates:
QSH
Cable Mates:
HQCD, HQDP
(See Also Available note)
Integral metal plane for
power or ground
Standard Stack Heights
from 5 mm to 25 mm
QTH/QSH
5 mm Stack Height
Rated @ 3dB Insertion Loss
Type
with PCB effects* w/o PCB effects**
Single-Ended Signaling
âD 9 GHz / 18 Gbps 9.5 GHz / 19 Gbps
Differential Pair Signaling âD 8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
Differential Pair Signaling âDP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTH or contact sig@samtec.com
QTH
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
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HypPe1C0rIt0EXrAaxGpnUrbsIeEpsosr®tâ¢
CwfoDownorwtwqa.IsnucnalteofmsSaiStntdIiGeAoiBacnT.@pscaApoonsmnnado/mpatâ¢reptospetcnao.octctooemls
A
OTHER
OPTION
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FILE NO: 090871_0_000
ALSO AVAILABLE
(MOQ Required)
⢠14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery speciï¬cations.)
⢠30µ" (0,76 µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
⢠Edge Mount & Guide Posts
⢠80 (-DP), 120, 150
positions per row
⢠Retention Option
Contact Samtec.
(7,11)
.280
â030, â060, â090
(60 total pins per bank = âD)
â020, â040, â060
(20 pairs per bank = âDâDP)
Specify
LEAD
STYLE
from
chart
âD = (No. of Pins per Row/30) x (20,00) .7875
âDP = (No. of Pairs per Row/20) x (20,00) .7875
(20,00) .7875
01
02
(0,50)
.0197
(0,20)
.008
â01 & â02
(0,76)
.030
(0,89)
.035
DIA
â03 thru â07
(0,64)
.025
âL
âF
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
âL
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
âC*
= Electro-Polished
Selective
50µ" (1,27 µm) min Au
over 150µ" (3,81 µm)
Ni on Signal Pins in
contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni
on all solder tails
âD
= Single-Ended
âDâDP
= Differential Pair
(â01 only)
âK
= (7,00 mm)
.275" DIA
Polyimide
ï¬lm Pick &
Place Pad
(N/A with -05 &
-07 lead style)
QTH
HEIGHT
LEAD A WITH
STYLE
QSH*
â01
(4,27) (5,00)
.168 .197
â02
(7,26) (8,00)
.286 .315
â03
(10,27) (11,00)
.404 .433
â04
(15,25) (16,00)
.600 .630
â05
(18,26) (19,00)
.718 .748
â07
(24,24) (25,00)
.954 .984
â TR
= Tape & Reel
(â090 positions
maximum)
âL
= Latching
Option
(â01 lead
style only)
(N/A on
â060 (âDâDP)
& â090)
*Processing conditions
will affect mated height.
*Note: âC Plating passes
10 year MFG testing
OTHER
SOLUTIONS
Note: Some lengths, styles
and options are non-standard,
non-returnable.
⢠Board Spacing Standoffs.
See SO Series.
WWW.SAMTEC.COM
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