QTE-040-09-H-D-A-K-TR Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH SPEED GROUND PLANE HEADER

F-213
QTE – 014 – 01– F – D – DP–A
®
QTE–040–01–L–D–A
(0,80 mm) .0315"
QTE–060–01–L–D–A
QTE SERIES
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contacts:
1.3A per contact @ 95°C
Ground Plane:
10.1A per ground plane @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
100
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact [e-mail]
APPLICATION
SPECIFIC OPTION
• 14mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56(-DP), 80, 100
positions per row
• Guide Posts, Screw Down
& Friction Lock
• Retention Option
Call Samtec.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Board Mates:
QSE
Integral metal plane
for power or ground
Cable Mates:
EQCD, EQSD, EQDP, EQRF
(See Application Specific note)
TM
Standard stack heights
from 5 mm to 25 mm
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSE
QTE/QSE
5 mm Stack Height
Rated @ 3dB Insertion Loss
Type
with PCB effects* w/o PCB effects**
Single-Ended Signaling –D 9 GHz / 18 Gbps 9 GHz / 18 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps 14 GHz / 28 Gbps
Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact [e-mail]
QTE
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
–020, –040, –060
(40 total pins per bank = –D)
–014, –028, –042
(14 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–F
= Gold Flash
on Signal Pins and
Ground Plane,
Matte Tin on tails
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
–D = (No. of Positions per Row/20)
x (20,00) .7875
(20,00) .7875
01
(5,97)
.235
02
(0,80)
(0,20)
.0315
.008
A
(0,76)
.030
–L
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
(7,11) = Electro-Polished
.280
Selective
50µ" (1,27 µm) min
Au over 150µ"
(3,81 µm) Ni on Signal
Pins in contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm) Ni
on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni on
all solder tails
(0,89)
.035 DIA
(0,64)
.025
––L
®
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TYPE _A
OTHER
OPTION
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
QTE
HEIGHT
LEAD A WITH
STYLE
QSE*
–01
(4,27) (5,00)
.168 .197
–02
(7,26) (8,00)
.286 .315
–03
(10,27) (11,00)
.404 .433
–04
(15,25) (16,00)
.600 .630
–05
(18,26) (19,00)
.718 .748
–07
(24,24) (25,00)
.954 .984
*Processing conditions
will affect mated height.
–K
= (7,00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
– TR
= Tape & Reel
Packaging
(N/A on 56 &
80 positions
or -05 & -07
lead style)
–L
= Latching
Option
(N/A on 42,
56, 60 & 80
positions)
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
WWW.SAMTEC.COM