QTE-020-03-L-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH-SPEED GROUND PLANE HEADER

F-217
QTE – 014 – 01– F – D – DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0.80 mm) .0315"
QTE SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles: 100
RoHS Compliant: Yes
Board Mates:
QSE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Standoffs:
SO
Integral metal plane
for power or ground
HIGH-SPEED CHANNEL PERFORMANCE
QTE-DP/QSE-DP @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [e-mail]
28
Gbps
Standard stack heights
from 5 mm to 25 mm
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
PROCESSING
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact [e-mail]
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594 FILE NO: 090871_0_000
PROTOCOLS
• 100 GbE
• XAUI
• PCI Express^®
• SATA
• MGT (Rocket I/O)
• InfiniBand^™
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount, Guide Posts,
Screw Down & Friction Lock
• 56 (-DP), 80, 100
positions per row
• Retention Option
Contact Samtec.
QTE
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE _A
OTHER
OPTION
–020, –040, –060
(40 total pins per bank = –D)
–014, –028, –042
(14 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–F
= Gold Flash
on Signal Pins and
Ground Plane,
Matte Tin on tails
–D
= Single-Ended
–D–DP
= Differential Pair
–K
= (7.00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–D–DP = (No. of Positions per Row/14)
x (20.00) .7875
–D = (No. of Positions per Row/20)
x (20.00) .7875
(20.00) .7875
01
(5.97)
.235
–L
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
(7.11)
.280
–C*
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150µ"
(–01 only)
– TR
= Tape & Reel
Packaging
(N/A –05 & –07
lead style)
–L
= Latching
Option
(N/A on –042 &
–060 positions)
02
A
(0.80)
.0315
(0.20)
.008
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1.27 µm) min Ni on
all solder tails
QTE
LEAD
STYLE
A
HEIGHT
WITH QSE*
–01 (4.27) .168 (5.00) .197
–02 (7.26) .286 (8.00) .315
–03 (10.27) .404 (11.00) .433
–04 (15.25) .600 (16.00) .630
(0.76)
.030
*Note: –C Plating passes
10 year MFG testing
–05 (18.26) .718 (19.00) .748
–07 (24.24) .954 (25.00) .984
(0.89)
.035 DIA
(0.64)
.025
–L
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–09 (13.26) .522 (14.00) .551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.