QSS-075-01-L-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH SPEED GROUND PLANE SOCKET

F-213
QSS–050–01–F–D–A
QSS–075–01–F–D–A
®
(0,635 mm) .025"
QSS–025–01–L–D–A
QSS SERIES
HIGH SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact: 1.1A per contact
@ 30°C Temperature Rise
Ground Plane: 7.8A per ground
plane@ 30°C Temperature Rise
Operating Temp:
-55°C to +125°C
Voltage Rating:
285 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (025-050)
(0,15 mm) .006" max (075)
Board Stacking:
For applications requiring more
than two connectors per board
contact [e-mail]
APPLICATION
SPECIFIC OPTION
• 11 mm & 16 mm
stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
• –LS2 Locking screw hole
for QTS–RA–LS2
Call Samtec.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Board Mates:
QTS
Cable Mates:
SQCD
Integral metal plane
for power or ground
Polarized
®
finalinch.com
QSS/QTS
5 mm Stack Height
Type Rated @ 3dB Insertion Loss*
Single-Ended Signaling –D
9 GHz / 18 Gbps
Differential Pair Signaling –D
8.5 GHz / 17 Gbps
Differential Pair Signaling –DP
8.5 GHz / 17 Gbps
*Performance data includes effects of a non-optimized PCB.
Performance data for other stack heights and complete
test data available at www.samtec.com?QSS or contact
[e-mail]
QSS
NO. OF POSITIONS
PER ROW
01
Blade & Beam
Design
PLATING
OPTION
Alignment
Pin
TM
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTS
DA
OTHER
OPTION
–025, –050, –075
(50 total positions per bank)
(No. of Positions per Row/25) x
(20,00) .7875 + (1,27) .050
(20,00) .7875
02
01
(3,63)
.143
(0,635)
.025
(0,15)
.006
(No. of Positions per Row/25) x
(20,00) .7875 + (10,90) .429
02
01 _{(No. of Positions per Row/25) x}
(20,00) .7875 + (5,72) .225
–F
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–L
= 10µ" (0,25 µm) Gold on Signal Pins
and Ground Plane, Matte Tin on tails
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over 150µ" (3,81 µm)
Ni on Signal Pins in contact area,
(7,49) _{10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni}
.295 _{on Ground Plane in contact area, Matte Tin}
over 50µ" (1,27 µm) min Ni on all solder tails
– GP
= Guide Holes
for mating
with QTS-RA
–K
= (8,25 mm)
.325" DIA
Polyimide Film
Pick &
Place Pad
– TR
= Tape and
Reel
(7,24)
.285 (0,76)
.030
(0,89)
.035
DIA
(3,56)
.140
DIA
ALSO AVAILABLE
• Board spacing
standoffs
(See SO Series)
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