QSS-025-01-L-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH-SPEED GROUND PLANE SOCKET

F-217
QSS–050–01–F–D–A
QSS–075–01–F–D–A
®
QSS–025–01–L–D–A
(0.635 mm) .025"
QSS SERIES
HIGH-SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact: 1.8 A per pin
(1 pin powered per row)
Ground Plane:
23.1 A per ground plane
(1 ground plane powered)
Operating Temp:
-55 °C to +125 °C
Voltage Rating:
285 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QTS
Cable Mates:
SQCD
Standoffs:
SO
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
HIGH-SPEED CHANNEL PERFORMANCE
QSS/QTS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [e-mail]
25
Gbps
PROCESSING
Integral metal plane
for power or ground
Blade & Beam
Design
Polarized
Alignment
Pin
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (025-050)
(0.15 mm) .006" max (075)
Board Stacking:
For applications requiring more
than two connectors per board
contact [e-mail]
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• 11 mm & 16 mm
stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
• –LS2 Locking screw hole
for QTS–RA–LS2
Contact Samtec.
QSS
02
01
02
01
NO. OF POSITIONS
PER ROW
–025, –050, –075
(50 total positions per bank)
(No. of Positions per Row/25) x
(20.00) .7875 + (1.27) .050
(20.00) .7875
(0.635)
.025
(0.15)
.006
(No. of Positions per Row/25) x
(20.00) .7875 + (10.90) .429
(No. of Positions per Row/25) x
(20.00) .7875 + (5.72) .225
01
PLATING
OPTION
DA
OTHER
OPTION
–F
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–L
= 10 µ" (0.25 µm) Gold on Signal Pins
and Ground Plane, Matte Tin on tails
(7.49)
.295
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal Pins
in contact area, 10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm) Ni on
Ground Plane in contact area,
Matte Tin over 50 µ" (1.27 µm) min
Ni on all solder tails
*Note: –C Plating passes
10 year MFG testing
– GP
= Guide Holes
for mating
with QTS-RA
–K
= (8.25 mm)
.325" DIA
Polyimide Film
Pick &
Place Pad
– TR
= Tape & Reel
(3.56)
.140
DIA
(7.24)
.285 (0.76)
.030
QTS
MATED HEIGHT
LEAD STYLE WITH QSS
–01
(5.00) .197
–02
(8.00) .315
Processing conditions will affect
mated height. See SO Series for
board space tolerances
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(3.63)
.143
(0.89)
.035
DIA
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.