QSH-060-01-L-D-A-K-TR Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH SPEED GROUND PLANE SOCKET

F-211-1
QSH–060–01–L–D–DP–A
(0,50mm) .0197"
QSH SERIES
®
QSH–030–01–F–D–A–RT1
QSH–060–01–L–D–A–K
HIGH SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSH
Insulator Material:
Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact [e-mail]
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm and
30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76µm) Gold
(Specify -H plating for Data
Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Board Mates:
QTH
Integral metal plane
for power or ground
Cable Mates:
HQCD, HQDP,
HFHM2
(See Application
Specific note)
®
finalinch.com
TM
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTH
Blade &
Beam Design
5mm Stack Height
Type Rated @ 3dB Insertion Loss
Single-Ended Signaling –D
9 GHz / 18 Gbps
Differential Pair Signaling –D
8 GHz / 16 Gbps
Differential Pair Signaling –DP
9.5 GHz / 19 Gbps
Performance data for other stack heights and complete
test data available at www.samtec.com?QSH or contact
[e-mail]
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
• Retention pin
option
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QSH
PINS PER ROW
NO. OF PAIRS
01
PLATING
OPTION
TYPE
A
OTHER
OPTION
–030, –060, –090, –120
(60 total pins per bank = –D)
–020, –040, –060, –080
(20 pairs per bank = –D–DP)
–D = (No. of Pins per Row/30) x
(20,00) .7875 + (1,27) .050
–DP = (No. of Pairs per Row/20) x
(20,00) .7875 + (1,27) .050
(20,00) .7875
02
(7,49)
.295
01
(0,50)
(0,15)
.0197
.006
(3,05)
.120
(7,24)
.285
(0,76)
.030
(0,89)
.035
DIA
–01
(3,81)
.150
–RT1
(3,76)
.148
DIA
(3,25)
.128
–L
–F
= Gold Flash
on Signal Pins
and Ground Plane,
Matte Tin on tails
–L
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished
Selective
50µ" (1,27µm) min Au
over 150µ" (3,81µm)
Ni on Signal Pins
in contact area,
10µ" (0,25µm) min Au
over 50µ" (1,27µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27µm) min Ni
on all solder tails
(0,64)
.025
–D
= Single-
Ended
–D–DP
= Differential
Pair
(–01 only)
QTH MATED
LEAD HEIGHT
STYLE WITH QSH*
–01 (5,00) .197
–02 (8,00) .315
–03 (11,00) .433
–04 (16,00) .630
–05 (19,00) .748
–07 (25,00) .984
*Processing
conditions will
affect mated height.
–K
= (8,25mm)
.325" DIA
Polyimide Film
Pick & Place Pad
– TR
= Tape & Reel
(–090 positions
maximum)
– RT1
= Retention
Option
(–090 positions
maximum)
–L
= Latching
Option
(N/A on
–060 (–D–DP),
–080, –090 &
–120 positions
or –RT1 option)
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