QSH-030-01-L-D-A-K Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH SPEED GROUND PLANE SOCKET

F-213
QSH–060–01–L–D–DP–A
(0,50 mm) .0197"
QSH SERIES
®
QSH–030–01–F–D–A
QSH–060–01–L–D–A–K
HIGH SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSH
Insulator Material:
Liquid Crystal
Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact:
1.0A per contact @ 30°C
Temperature Rise
Ground Plane:
7.8A per ground plane @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Yes
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (030-060)
(0,15 mm) .006" max (090)
Board Stacking:
For applications requiring
more than two connectors per
board contact [e-mail]
APPLICATION
SPECIFIC OPTION
• 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for Data
Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80(-DP), 120, 150
positions per row
• Retention Option
Call Samtec.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Board Mates:
QTH
Blade &
Beam Design
Cable Mates:
HQCD, HQDP
(See Application Specific note)
TM
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTH
QTH/QSH
5 mm Stack Height
Rated @ 3dB Insertion Loss
Type
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D 9 GHz / 18 Gbps 9.5 GHz / 19 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
Differential Pair Signaling –DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QSH or contact [e-mail]
Integral metal plane
for power or ground
®
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QSH
PINS PER ROW
NO. OF PAIRS
01
PLATING
OPTION
TYPE
A
OTHER
OPTION
–030, –060, –090
(60 total pins per bank = –D)
–020, –040, –060
(20 pairs per bank = –D–DP)
–D = (No. of Pins per Row/30) x
(20,00) .7875 + (1,27) .050
–DP = (No. of Pairs per Row/20) x
(20,00) .7875 + (1,27) .050
(20,00) .7875
02
(7,49)
.295
01
(0,50)
(0,15)
.0197
.006
(3,05)
.120
(7,24)
.285 _(0,76)
.030
(0,89)
.035
DIA
(3,25)
.128
(0,64)
.025
–L
–F
= Gold Flash
on Signal Pins
and Ground Plane,
Matte Tin on tails
–L
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished
Selective
50µ" (1,27 µm) min Au
over 150µ" (3,81 µm)
Ni on Signal Pins
in contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni
on all solder tails
–D
= Single-
Ended
–D–DP
= Differential
Pair
(–01 only)
QTH MATED
LEAD HEIGHT
STYLE WITH QSH*
–01 (5,00) .197
–02 (8,00) .315
–03 (11,00) .433
–04 (16,00) .630
–05 (19,00) .748
–07 (25,00) .984
*Processing
conditions will
affect mated height.
–K
= (8,25 mm)
.325" DIA
Polyimide Film
Pick & Place Pad
– TR
= Tape & Reel
(–090 positions
maximum)
–L
= Latching
Option
(N/A on
–060 (–D–DP),
–080, –090 &
–120 positions)
ALSO
AVAILABLE
Board Spacing Standoffs.
See SO Series.
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