QSH-020-01-L-D-DP-A Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH-SPEED GROUND PLANE SOCKET

F-217
QSH–060–01–L–D–DP–A
QSH–060–01–L–D–A–K
®
(0.50 mm) .0197"
QSH–030–01–F–D–A
QSH SERIES
HIGH-SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSH
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Board Mates:
QTH
Cable Mates:
HQCD, HQDP
(See Also Available Note)
Standoffs:
SO
Blade &
Beam
Design
HIGH-SPEED CHANNEL PERFORMANCE
QTH/QSH @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [e-mail]
25
Gbps
Integral metal plane
for power or ground
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
PROCESSING
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact [e-mail]
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594 FILE NO: 090871_0_000
PROTOCOLS
• 100 GbE
• Hypertransport^™
• XAUI
• PCI Express^®
• InfiniBand^™
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
Contact Samtec.
Note: Some lengths, styles
and options are non-standard,
non-returnable.
QSH
PINS PER ROW
NO. OF PAIRS
01
PLATING
OPTION
TYPE
A
OTHER
OPTION
–030, –060, –090
(60 total pins per bank = –D)
–020, –040, –060
(20 pairs per bank = –D–DP)
–D = (No. of Pins per Row/30) x
(20.00) .7875 + (1.27) .050
–DP = (No. of Pairs per Row/20) x
(20.00) .7875 + (1.27) .050
(20.00) .7875
02
(7.49)
.295
01
(0.50)
(0.15)
.0197
.006
(3.05)
.120
(7.24)
.285 _(0.76)
.030
–F
= Gold Flash
on Signal Pins
and Ground Plane,
Matte Tin on tails
–L
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
(3.25)
.128
–C*
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150 µ" (3.81 µm)
Ni on Signal Pins
in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over
50 µ" (1.27 µm) min Ni
on all solder tails
*Note: –C Plating passes
10 year MFG testing
(0.89)
.035
DIA
(0.64)
.025
–L
–D
= Single-
Ended
–D–DP
= Differential
Pair
(–01 only)
–K
= (8.25 mm)
.325" DIA
Polyimide Film
Pick & Place Pad
– TR
= Tape & Reel
(–090 positions
maximum)
–L
= Latching
Option
(Not available on
–060 (–D–DP)
& –090 positions)
QTH
LEAD STYLE
–01
–02
–03
–04
–05
–07
–09
MATED HEIGHT
WITH QSH*
(5.00) .197
(8.00) .315
(11.00) .433
(16.00) .630
(19.00) .748
(25.00) .984
(14.00) .551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.