QSE-EM Datasheet, PDF (1/2 Pages) Samtec, Inc – .8mm EDGE MOUNT HS SOCKET ASSEMBLY

REVISION AD
DO NOT
SCALE FROM
THIS PRINT
((No OF POSITIONS / 20) x .7875[20.003]) + .440[11.18] REF
QSE-XXX-01-X-D-EMX-XX
C
((No OF POSITIONS / 20) x .7875[20.003]) + .0100[.254] REF
No OF POSITIONS
-020, -040, -060
**-080, **-100
(PER ROW)
19 EQ SPACES
@ .0315[.800]
02
LEAD STYLE
-01: .1380 [3.505]
PLATING SPECIFICATION
.2850 7.239
REF
01
.022 0.57
REF
C
.118 3.00
.1750 4.445
REF
.625 15.88
REF
SEE NOTE 12
"A"
'A'
C
PLATING THICKNESSES ARE FOR
SIGNAL PINS ONLY. FOR GROUND
PLANE THICKNESSES, SEE PP-T-1G13-XX-X.
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT
AREA MATTE TIN ON TAIL (SEE NOTE 6)
(USE C-162-XX-F & T-1G13-01-F)
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT
AREA WITH MATTE TIN ON TAIL
(USE C-162-XX-L & T-1G13-01-L)
-H: 30µ" HEAVY GOLD IN CONTACT AREA
3µ" FLASH GOLD ON TAILS
(USE C-162-XX-H & T-1G13-01-G)
-TL: TIN/LEAD (90/10 5%) CONTACT AND TAIL
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
(USE C-162-XX-S & T-1G13-01-L)
.1380±.0030 3.505±0.08
(SEE NOTE 5)
.165±.003 4.19±0.076
C
C
OPTION
*
-GP: GUIDE POST (60 POS MAX)
(SEE FIG 2, SEE SHEET 2)
-TY: TRAY PACKAGING
* EM3-GP = NOT TOOLED
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE QSE-20-01-D-EM2-XX & C-162-01-X)
-EM3:
(USE QSE-20-01-D-EM3-XX & C-162-02-X)
(SEE NOTE 10)
ROW SPECIFICATION
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)
No OF BANKS
* = SEE NOTE 10
** = SEE NOTE 13
QSE-20-01-D-EM2-XX
C-162-01-X
QSE-20-01-D-EM3-XX
C-162-02-X
SEE TABLE 1
.238 6.05
REF
.155 3.92
REF
"A"
.006 0.15
REF
.1200 3.048
REF
.7250 18.415
REF
FIG 1
.0315 0.800
REF
.0400 1.016 REF
.120 3.05 REF
C
.0660±.0030 1.676±0.08
.0920±.0030 2.338±0.08
T-1G13-01-X
2 MAX SWAY C
(EITHER DIRECTION)
SECTION "A"-"A"
-EM2: .064[1.63] +/-.004 PCB
C
SECTION "A"-"A"
-EM3:
SEE NOTE 10
[DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS]
.100 2.54 REF
.1400 3.556 REF
NOTES:
1. ^C REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM CONTACT RETENTION: 6 OZ
3. MINIMUM GROUND PLANE RETENTION: 8 OZ
4. PARTS ARE MOLD TO POSITION.
5. MAXIMUM VARIANCE OF .002[0.05]
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER
PAD TO SOLDER PAD.
9. SEE WWW.SAMTEC. COM/PROCESSING/
EDGEMOUNT_TECTALK/INDEX.HTM FOR INFORMATION ON
PROCESSING EDGEMOUNT PARTS TO BOARDS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH
ORDER INQUIRIES
11. NOTE DELETED.
12. SIDE WALLS ARE RIBBED AS NECESSARY TO CONTROL BOW.
13. AVAILABLE FOR EXISTING CUSTOMERS ONLY.
** = SEE NOTE 13
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
ANGLES
.XX: .01[.3]
2
.XXX: .005[.13]
.XXXX: .0020[.051]
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: [phone] FAX: [phone]
e-Mail [e-mail] code 55322
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 1.375:1 DESCRIPTION:
INSULATOR: LCP, UL 94VO
-EM2 COLOR: BLACK
-EM3 COLOR: NATURAL
CONTACT & GROUND PLANE: PHOS BRONZE
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-EMX-XX-MKT.SLDDRW
.8mm EDGE MOUNT HS SOCKET ASSEMBLY
DWG. NO.
QSE-XXX-01-X-D-EMX-XX
BY: DEAN P 5/24/2000 SHEET 1 OF 2