QSE-040-01-L-D-A-GP Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH SPEED GROUND PLANE SOCKET

F-213
QSE–028–01–F–D–DP–A
®
(0,80 mm) .0315"
QSE SERIES
QSE–020–01–L–D–A
QSE–060–01–F–D–A
HIGH SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSE
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contacts:
1.3A per contact @ 95°C
Ground Plane:
10.1A per ground plane @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact [e-mail]
APPLICATION
SPECIFIC OPTION
• 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please
consult machinery
specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56 (-DP), 80, 100
positions per row
• Guide Posts and Friction
Lock options.
• Retention Option
Call Samtec.
Board Mates:
QTE
Cable Mates:
EQCD, EQSD, EQDP, EQRF
(See Application Specific note)
Blade &
Beam
Design
TM
Integral metal plane
for power or ground
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTE
QTE/QSE
5 mm Stack Height
Rated @ 3dB Insertion Loss
Type
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D 9 GHz / 18 Gbps 9 GHz / 18 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps 14 GHz / 28 Gbps
Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QSE or contact [e-mail]
®
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QSE
PINS PER ROW
NO. OF PAIRS
01
PLATING
OPTION
TYPE
A
OTHER
OPTION
(7,24)
.285
(3,05)
.120
–F
–020, –040, –060
(40 total pins per bank = –D)
–014, –028, –042
(14 pairs per bank = –D–DP)
–D–DP = (No. of Positions per Row/14) x
(20,00) .7875 + (1,27) .050
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
–L
= 10µ" (0,25 µm) Gold
on Signal Pins
and Ground Plane,
–D
= Single-
Ended
–D–DP
= Differential
Pair
(–01 only)
–D = (No. of Positions per Row/20) x
Matte Tin on tails
(20,00) .7875 + (1,27) .050
(20,00) .7875
02
–C*
= Electro-Polished
Selective
QTE MATED
(7,49) 50µ" (1,27 µm) min ^{LEAD HEIGHT}
.295
Au over 150µ"
STYLE WITH QSE*
(3,81 µm) Ni on Signal –01 ^{(5,00) .197}
01
(0,80)
.0315
(0,15)
.006
(3,25)
.128
Pins in contact area,
10µ" (0,25 µm) min
Au over 50µ" (1,27 µm)
Ni on Ground Plane
–02
–03
–04
(8,00) .315
(11,00) .433
(16,00) .630
in contact area,
–05 (19,00) .748
(0,76)
Matte Tin over 50µ"
(1,27 µm) min Ni on
all solder tails
–07 (25,00) .984
*Processing
conditions will
affect mated height.
.030
–K
= (8,25 mm) .325"
DIA Polyimide
Film Pick &
Place Pad
– TR
= Tape & Reel
Packaging
(N/A on 56 &
80 positions)
–L
= Latching Option
(N/A on 42, 56, 60
& 80 positions)
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(0,89)
.035
DIA
(0,64)
.025
–L
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
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