QSE-020-01-F-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH-SPEED GROUND PLANE SOCKET

F-217
QSE–028–01–F–D–DP–A
®
QSE–020–01–L–D–A
QSE–060–01–F–D–A
(0.80 mm) .0315"
QSE SERIES
HIGH-SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
Contacts:
2 A per pin
(1 pin powered per row)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Board Mates:
QTE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Standoffs:
SO
Blade &
Beam
Design
HIGH-SPEED CHANNEL PERFORMANCE
QSE-DP/QTE-DP @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [e-mail]
28
Gbps
Integral metal plane
for power or ground
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
PROCESSING
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact [e-mail]
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594 FILE NO: 090871_0_000
PROTOCOLS
• 100 GbE
• XAUI
• PCI Express^®
• SATA
• MGT (Rocket I/O)
• InfiniBand^™
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 56 (-DP), 80, 100
positions per row
• Retention, Guide Posts and
Friction Lock options.
Contact Samtec.
QSE
PINS PER ROW
NO. OF PAIRS
01
PLATING
OPTION
TYPE
A
OTHER
OPTION
(7.24)
.285
(3.05)
.120
–F
–020, –040, –060
(40 total pins per bank = –D)
–014, –028, –042
(14 pairs per bank = –D–DP)
–D–DP = (No. of Positions per Row/14) x
(20.00) .7875 + (1.27) .050
–D = (No. of Positions per Row/20) x
(20.00) .7875 + (1.27) .050
(20.00) .7875
02
01
(0.80)
.0315
(0.15)
.006
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
–L
= 10 µ" (0.25 µm) Gold
on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished
Selective
50 µ" (1.27 µm) min
(7.49)
Au over 150 µ"
.295 ^{(3.81 µm) Ni on Signal}
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
(3.25)
.128
Matte Tin over 50 µ"
(1.27 µm) min Ni on
all solder tails
–D
= Single-
Ended
–D–DP
= Differential
Pair
(–01 only)
–GP
= Guide Post
(–020 only)
–K
= (8.25 mm) .325"
DIA Polyimide
Film Pick &
Place Pad
– TR
= Tape & Reel
Packaging
–L
= Latching Option
(N/A on –042
& –060 positions)
QTE
MATED HEIGHT
LEAD STYLE WITH QSE*
–01
(5.00) .197
–02
(8.00) .315
(0.76)
.030
(0.89)
.035
DIA
(0.64)
.025
–L
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–03
(11.00) .433
–04
(16.00) .630
–05
(19.00) .748
–07
(25.00) .984
–09
(14.00) .551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.