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QRM8-026-05.0-L-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – SLIM BODY GROUND PLANE HEADER
F-217
QRM8–078–05.0–L–D–A
QRM8–036–05.0–L–D–DP–A–K
(0.80 mm) .0315"
QRM8–026–02.0–L–D–A
QRM8 SERIES
SLIM BODY GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QRM8
Insulator Material:
Black LCP
Terminal & Ground
Plane Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2.2 A per pin
(1 pin powered per row)
Ground:
8.5 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
215 VAC
RoHS Compliant:
Yes
Board Mates:
QRF8
Cable Mates:
EQRD
HIGH-SPEED CHANNEL PERFORMANCE
QRM8-DP/QRF8-DP @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
31
Gbps
Integral
ground/power
plane
Choice of
stack heights
(1.20 mm)
.047"
NOMINAL
WIPE
Increased wipe for
rugged applications
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (018-026)
(0.15 mm) .006" max (036-078)
QRM8
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
PROTOCOLS
• 100 GbE
ALSO AVAILABLE
(MOQ Required)
• Other platings
Contact Samtec.
MATED HEIGHT*
QRM8
LEAD
STYLE
QRF8 LEAD STYLE
–05.0 –07.0
– 02.0
(7.00) (9.00)
.276
.354
– 05.0
(10.00) (12.00)
.394
.472
– 07.0
(12.00) (14.00)
.472
.551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances.
Note: Patented
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–026, –052, –078
(52 total pins per bank = –D)
–018, –036, –054
(18 pairs per bank = –D–DP)
–02.0
= 2 mm
Body Height
(Not available
with –054 &
–078 positions)
–05.0
= 5 mm
Body Height
–07.0
= 7 mm
Body Height
No. of Banks x (24.80) .976 + (1.77) .070
01
02
(0.80) .0315
(1.00)
.039
DIA
No. of Banks x (24.80) .976 - (1.10) .043
(1.89)
.074
–L
= 10 µ"
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
–D
= Single-
Ended
–D–DP
= Differential
Pair
(4.60)
.181
LEAD
STYLE
A
B
– 02.0
(4.81)
.189
(6.12)
.241
– 05.0
(7.81)
.307
(9.12)
.359
– 07.0
(9.78)
.385
(11.12)
.438
(2.20)
(1.32) .087
.052
A
(3.67)
.145
(3.18)
.125
B
No. of Banks x (24.80) .976 + (3.55) .140
–GP OPTION
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
– GP
= Guide Post
(Requires –GP on
mating connector)
–K
= (5.00 mm) .197" DIA
Polyimide Film
Pick & Place Pad
– TR
= Tape & Reel
(–018, –026,
–036, –052 only)
• Edge Rate®
contacts
• Increased contact
wipe
• 10 year MFG
• Guide post option