QMS-026-09.75-SL-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – RUGGED GROUND PLANE HEADER

F-217
QMS – 032 – 0 6.75 – L– D – DP–A
QMS – 026 – 0 6.75 – L– D –A
(0.635 mm) .025"
RUGGED GROUND PLANE HEADER
QMS SERIES
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QMS
Insulator Material:
Liquid Crystal Polymer
Terminal & Ground
Plane Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
(Tin on Ground Plane Tail)
Current Rating:
Contact:
2.6 A per pin
(1 pin powered per row)
Ground Plane:
15.7 A per ground plane
(1 ground plane powered)
Operating Temp:
-55 °C to +125 °C
Voltage Rating:
300 VAC mated with QFS
RoHS Compliant:
Yes
Board Mates:
QFS
Cable Mates:
6QCD
Standoffs:
SO, JSOM
Integral metal plane
for power or ground
(1.60 mm)
.063"
NOMINAL
WIPE
HIGH-SPEED CHANNEL PERFORMANCE
QMS-DP/QFS-DP @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [e-mail]
25
Gbps
Increased
insertion depth for
rugged applications
ALSO
AVAILABLE
(MOQ Required)
• Other platings
• Guide Posts
• Without PCB
Alignment Pins
(05.75 and 06.75 only)
• Hot Pluggable
• 64 (-DP) and 104
positions per row
Contact Samtec.
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (026-052)
(0.15 mm) .006" max (078)
Board Stacking:
For applications requiring more
than two connectors per board,
contact [e-mail]
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
STANDARDS
• SUMIT^™
• PCI/104-Express^™
PROTOCOLS
• 100 GbE
• FIbre Channel
• XAUI
• PCI Express^®
• SATA
Note: Some lengths,
styles and options are
non-standard, non-returnable.
QMS
PINS PER ROW LEAD
NO. OF PAIRS STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
–026, –052, –078
(52 total pins per bank = –D)
–016, –032, –048
(16 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–L
(–05.75 and –06.75 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
–D
= Single-Ended
– D–DP
= Differential Pair
–K
= (5.50 mm)
.217" DIA
Polyimide
film
Pick &
Place Pad
(–078 & –048 Not available
with –09.75 lead style)
–SL
(–09.75 lead style only)
APPLICATION
MATED HEIGHT*
= 10 µ" (0.25 µm) Gold on Signal
LEAD
STYLE
A
QFS LEAD STYLE
–04.25 –06.25
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
–05.75 (5.38) .212
–06.75 (6.35) .250
10 mm
11 mm
12 mm
13 mm
STACK
HEIGHT
(0.44)
.017
–09.75 (9.35) .368 14 mm
16 mm
*Processing conditions will affect mated height.
See SO Series for board space tolerances.
(6.35)
.250
(0.25)
.010
Requires Standoff
(No. of Banks) x (21.34) .840 - (0.51) .020
SO-1524-03-01-01-L or
JSOM-1524-02 for 15.24 mm
(21.34) .840
01
(7.26)
(7.52)
.296
or SO-2215-02-01-01-L for 22 mm
board spacing. Connectors designed
to not fully seat when mated.
(2.29)
.090
(0.635) (0.23)
.025 .009
.286
02
INDUSTRY
STANDARD
INTERCONNECTS
TERMINAL
SOCKET
BANKS
STACK
HEIGHT
SUMIT^™
ASP-129637-01 ASP-129646-01 1 15.24 mm
PCI/104-Express^™ ASP-129637-03 ASP-129646-03 3 15.24 mm
A
PCI/104-Express^™ ASP-129637-13 ASP-129646-22 1 15.24 mm
PCI/104-Express^™ ASP-142781-02 ASP-129646-02 2
22 mm
–D
–D–DP
PCI/104-Express^™ ASP-142781-03 ASP-129646-03 3
22 mm
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.