QFS-052-04.25-L-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – RUGGED GROUND PLANE SOCKET

F-217
QFS–026–04.25–L–D–A
(0.635 mm) .025"
QFS–026–04.25–L–D–A–GP
QFS–032–04.25–L–D–DP–A
QFS SERIES
RUGGED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QFS
Insulator Material:
Liquid Crystal Polymer
Contact & Ground
Plane Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
(Tin on Ground Plane Tail)
Current Rating:
Contact:
2.6 A per pin
(1 pin powered per row)
Ground Plane:
15.7 A per ground plane
(1 ground plane powered)
Voltage Rating:
300 VAC mated with QMS
Operating Temp:
-55 °C to +125 °C
RoHS Compliant:
Yes
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (026-078)
Board Stacking:
For applications requiring more
than two connectors per board
contact [e-mail]
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
STANDARDS
• SUMIT^™
• PCI/104-Express^™
PROTOCOLS
• 100 GbE
• FIbre Channel
• XAUI
• PCI Express^®
• SATA
Note: Some lengths,
styles and options are
non-standard, non-returnable.
Board Mates:
QMS
Cable Mates:
6QCD
Standoffs:
SO, JSOM
Increased insertion
depth for rugged applications
(1.60 mm)
.063"
NOMINAL
WIPE
HIGH-SPEED CHANNEL PERFORMANCE
QMS-DP/QFS-DP @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [e-mail]
25
Gbps
Integral metal plane
for power or ground
ALSO
AVAILABLE
(MOQ Required)
• Other platings
• Without PCB
Alignment Pins
• Hot Pluggable
• 4 banks
(104 -SE, 64 -DP)
Contact Samtec.
QFS
PINS PER ROW LEAD
NO. OF PAIRS STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
–026, –052, –078
(52 total pins per bank = –D)
–016, –032, –048
(16 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–L
(–04.25 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
MATED HEIGHT*
LEAD
STYLE
A
QMS LEAD STYLE
–05.75 –06.75 –09.75
–04.25 (7.44) .293 10 mm 11 mm 14 mm
–06.25 (9.42) .371 12 mm 13 mm 16 mm
*Processing conditions will affect mated height.
See SO Series for board space tolerances.
–SL
(–06.25 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
(0.10)
.004
–D
= Single-Ended
–D–DP
= Differential Pair
(–04.25 lead style only)
– GP
= Guide
Holes
( –04.25
lead style
only)
APPLICATION
STACK
HEIGHT
(0.44)
.017
GP = No. of Banks x (21.34) .840 + (12.45) .490
No. of Banks x (21.34) .840 + (1.02) .040
(21.34) .840
(0.635)
.025 ₀₂
(8.13)
.320
01
(0.89)
.035
(1.02) .040 DIA
–D
–D–DP
A
(8.13)
.320
Requires Standoff
SO-1524-03-01-01-L or
JSOM-1524-02 for 15.24 mm
or SO-2215-02-01-01-L for 22 mm
board spacing. Connectors designed
to not fully seat when mated.
INDUSTRY
STANDARD
INTERCONNECTS
TERMINAL
SOCKET
BANKS
STACK
HEIGHT
SUMIT^™
ASP-129637-01 ASP-129646-01 1 15.24 mm
PCI/104-Express^™ ASP-129637-03 ASP-129646-03 3 15.24 mm
PCI/104-Express^™ ASP-129637-13 ASP-129646-22 1 15.24 mm
PCI/104-Express^™ ASP-142781-02 ASP-129646-02 2
22 mm
PCI/104-Express^™ ASP-142781-03 ASP-129646-03 3
22 mm
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.