MIS-019-01-F-D-K Datasheet, PDF (1/1 Pages) Samtec, Inc – MIXED TECHNOLOGY SOCKET

F-217
MIS–019–01–F–D
®
MIS–038–01–F–D
(0.635 mm) .025"
MIXED TECHNOLOGY SOCKET
MIS–057–01–L–D
MIS SERIES
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MIS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
275 VAC
Max Cycles:
100
RoHS Compliant:
Yes
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (019-057)
Board Stacking:
For applications requiring more
than two connectors per board
contact [e-mail]
RECOGNITIONS
Board Mates:
MIT
Standoffs:
SO
• Mixed
technology
footprint
HIGH-SPEED CHANNEL PERFORMANCE
MIT/MIS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [e-mail]
28
Gbps
MIS
NO. OF POSITIONS
PER ROW
Integral metal plane
for power or ground
Polarized
76 signal lines
per linear inch
01
PLATING
OPTION
D
OTHER
OPTION
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• 11 mm, 16 mm, 18.75 mm
and 22 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 76, 95, 114 and 133
positions per row
Contact Samtec.
(6.22)
.245
–019, –038, –057
(38 total positions per bank)
(No. of Positions/19) x (12.70) .500 + (12.70) .500
(12.70) .500
01
(0.635)
.025
02
(0.15)
.006
–F
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–L
= 10 µ" (0.25 µm)
Gold on Signal Pins and
Ground Plane, Matte Tin on tails
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on
Signal Pins in contact area,
10 µ" (0.25 µm) min Au over
50 µ" (1.27 µm) Ni on Ground
Plane in contact area, Matte Tin
over 50 µ" (1.27 µm) min Ni
on all solder tails
–K
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
–TR
= Tape &
Reel
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(1.32)
.052
(0.69) .027
(3.43)
.135
(7.49)
.295
Note: Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press-fit) for added retention to PCB.
(3.63)
.143
(0.18)
.007
MATED HEIGHT*
MIS
LEAD
STYLE
MIT LEAD
STYLE
–01 –02
– 01
(5.00) (8.00)
.197 .315
*Processing conditions
will affect mated height.
See SO Series for board
space tolerances.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.