MEC1-120-02-F-D-RA1-SL Datasheet, PDF (1/1 Pages) Samtec, Inc – MINI EDGE CARD SOCKET

F-210-1
MEC1–120 – 02 – F – D –A
(1,00mm) .03937"
MEC1 SERIES
MEC1–140 – 02 – L– D
MINI EDGE CARD SOCKET
MEC1–130 – 02 – F – D –A
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MEC1
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Sn or Au over 50µ"
(1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
2A @ 80°C ambient
(See website for details)
Voltage Rating:
300 VAC
Insertion Depth:
(5,84mm) .230" to
(8,13mm) .320"
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (05-20)
(0,15mm) .006" max (30-70)
Mates with:
(1,60mm) .062" card
APPLICATION
1mm MEC1
Rated @ -3dB Insertion Loss
9,19mm Stack Height
Single-Ended Signaling
5.5 GHz / 11 Gbps
Differential Pair Signaling
6.5 GHz / 13 Gbps
Performance data for other stack heights and complete test data
available at www.samtec.com?MEC1 or contact [e-mail]
MEC1
1
POSITIONS
PER ROW
02
Mates with
(1,60mm)
.062" card
(1,00mm)
.03937" pitch
APPLICATION
SPECIFIC
OPTION
• Locking Clip (Manual
placement required).
• Non-polarized
Call Samtec.
PLATING
OPTION
D
OTHER
OPTION
05, 08, 20, 30, 40, 50, 60, 70
(No. of Positions + 2) x
(1,00) .03937 + (2,54) .100
02
140
(6,99)
.275
01
(1,00)
.03937
(0,36) ¹³⁹
(1,83)
.072
.014
(No. of Positions + 2)
x (1,00) .03937
–F
= Gold flash on contact,
Matte tin on tail
–L
= 10µ" (0,25µm) Gold on contact,
Matte Tin on tail
POSITIONS
PER ROW
POLARIZED
POSITIONS
(No Contact)
05
3, 4
08
5, 6
20
15, 16
30
21, 22
40
31, 32
50
41, 42
60
31, 32, 63 & 64
70
53, 54, 115 & 116
–A
= Alignment
Pin metal or
plastic at
Samtec
discretion.
–K
= (7,87mm)
.310" DIA
Polyimide film
Pick &
Place Pad
– TR
= Tape & Reel
Note: Other Gold plating
options available.
Contact Samtec.
Note: Some sizes, styles and
options are non-standard,
non-returnable.
(8,89)
.350
(9,04) (0,15)
.356 .006
(8,51)
.335
WWW.SAMTEC.COM
(1,40)
.055
(0,89)
.035
DIA
–A
OPTION