HPF-03-01-T-S Datasheet, PDF (1/1 Pages) Samtec, Inc – POWER SOCKETS

F-214
HPF –18 – 01–T– S
HPF –10 – 02 –T– S
(5,08 mm) .200"
POWER SOCKETS
HPF SERIES
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?HPF
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Sn over
50µ" (1,27 µm) Ni
Insertion Depth:
(3,68 mm) .145" to (8,26 mm)
.325" (.368" (9,35 mm) plus
board thickness minimum for
bottom entry)
Wiping Distance:
(0,38 mm) .015"
Insertion Force:
(Single contact only)
56 oz (15,57 N) avg.
Withdrawal Force:
(Single contact only)
52 oz (14,46 N) avg.
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,15 mm) .006" max (02-10)
(0,20 mm) .008" max (11-20)
RoHS Compliant:
Yes
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
Mates with:
HPM, HPW
PINS
1
2
3
4
ALL
HPF/HPM
CURRENT RATING
(PER CONTACT)
16.6 A
14.4 A
13.2 A
12.7 A
8.9 A
HPF
NO. PINS
PER ROW
02 thru 20
FILE NO: 090871 0 000
Surface Mount
or
Through-hole
(5,08 mm)
.200" pitch
• Three-finger
Power Eye contact
• Locking clip option
LEAD
STYLE
–01
= Through-hole
–02
= Surface Mount
PLATING
OPTION
S
–T
= Matte Tin
No. of Positions x (5,08) .200
(5,08)
.200
(5,08)
.200
OTHER
OPTIONS
– LC
= Locking Clip
(Manual
placement
required)
(Style –02 only)
–K
= (6,50 mm) .256"
DIA Polyimide
Film Pick &
Place Pad
– TR
= Tape & Reel
Packaging
(14 positions
maximum)
(Style –02 only)
(2,59)
.102
(8,89)
.350
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(0,46)
.018
(2,46)
.097
– 01
(1,14)
.045
WWW.SAMTEC.COM
(9,35)
.368
(7,11)
.280
– 02