HDLSP-035-1000 Datasheet, PDF (1/1 Pages) Samtec, Inc – HIGH-DENSITY/HIGH-SPEED CABLE SYSTEM

F-217
(0.635 mm) .025"
HDLSP–035–1000
HDLSP SERIES
HIGH-DENSITY/HIGH-SPEED CABLE SYSTEM
SPECIFICATIONS
Mates with:
HDI6
For complete specifications and
recommended PCB layouts see
www.samtec.com?HDLSP
Cable:
32 AWG low skew
pair cable
Insulator Material:
LCP
Terminal Material:
Phosphor Bronze
Jacket Material:
PVC
Insulator:
Dielectric
Conductors:
Copper
Braid:
Tinned Copper
Covers:
Diecast Zinc Alloy
Current Rating:
1.5 A per pin
(4 adjacent pins
powered)
OTHER SOLUTIONS
For HT3.1 see
www.samtec.com/ht3
and specify part number
HDR-149112-XXXX.
ALSO AVAILABLE
(MOQ Required)
• Other lengths
Contact Samtec.
TYPE
HDLSP
= High-density
Low Skew Pair Cable
Industry’s densest
I/O cable system
12 pairs
per side
NO. OF
POSITIONS
–035
(Per Row)
= 12 Pairs per side
32 AWG low skew
pair cable
Designed
for heavy
duty handling
48 pairs in 28 mm x 14 mm
panel opening
LENGTH
– “XXXX”
= Length in millimeters
–1000, –2000
(Standard lengths)
B35
B1
(35.13) 1.383
A35
(25.50) (22.85)
1.004 .900
A1
(6.10)
.240
(4.58)
.180
LENGTH
Supplied with
dust caps
Note: Some lengths, styles
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.