ERF8-010-05.0-S-DV-K-TR Datasheet, PDF (1/1 Pages) Samtec, Inc – RUGGED HIGH-SPEED SOCKET

F-217 (Rev 06MAR17)
ERF8 – 020 – 05.0 – S – DV–TR
ERF8 – 040 – 05.0 – S – DV–TR
(0.80 mm) .0315"
ERF8 – 0 60 – 05.0 – L– DV–TR
RUGGED HIGH-SPEED SOCKET
ERF8 SERIES
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?ERF8
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
2.2 A per pin
(1 pin powered per row)
Operating Temp Range:
-55 °C to + 125 °C
Voltage Rating:
225 VAC / 318 VDC
RoHS Compliant:
Yes
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (005-030)
(0.12 mm) .005" max (040-060)
(0.15 mm) .006" max (070-100)
RECOGNITIONS
Board Mates:
ERM8
Cable Mates:
ERCD, ERDP
Robust Edge Rate^®
contact improves
“Zippered” unmating
MATED HEIGHT*
ERF8
ERM8 LEAD STYLE
LEAD
STYLE
–02.0
–05.0
–08.0
– 09.0
– 05.0
(7.00)
.276
(10.00) (13.00) (14.00)
.394 .512 .551
–07.0
(9.00)
.354
(12.00) (15.00) (16.00)
.472 .591 .629
*Processing conditions will affect mated height.
HIGH-SPEED CHANNEL PERFORMANCE
ERM8/ERF8 @ 7 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [e-mail]
23
Gbps
ERF8
NO. OF POSITIONS
PER ROW
LEAD
STYLE
PLATING
OPTION
For complete scope of
recognitions see
www.samtec.com/quality
Specify
FILE NO. E111594
PROTOCOLS
• 100 GbE
–005, –010, –011,
–013, –020, –025,
–030, –035 –040, –049,
–050, –060, –070, –075
LEAD
STYLE
from
chart
• PCI Express^™
–100
(Available with –05.0 lead style only)
APPLICATIONS
STANDARD POS. PART NOs. SERIES
LEAD
STYLE
– 05.0
– 07.0
A
(5.10)
.200
(7.00)
.276
NEXUS5001^™.org
POWER.org^™
ARM/HSSTP
NEXUS5001^™.org
POWER.org^™
10 ASP-148421-01 ERF8-DV
11 ASP-137969-01 ERF8-DV
17 ASP-137973-01 ERF8-DV
20 ASP-130367-01 ERF8-DV
23 ASP-130368-01 ERF8-DV
25 ASP-148422-01 ERF8-DV
35 ASP-135029-01 ERF8-DV
40 ASP-148424-01 ERF8-DV
(3.35)
.132
No. of Positions x
(0.80) .0315 + (6.00) .236
–L & –EGP = No. of Positions x
(0.80) .0315 + (7.50) .295
–EGPS = No. of Positions x
(0.80) .0315 + (10.00) .394 ₀₁
(5.60)
.220
02
ALSO AVAILABLE
(MOQ Required)
• Mezzanine stack heights
(3.35)
Contact Samtec.
.132
A
–L
= 10 µ"
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
–S
= 30 µ"
(0.76 µm)
Gold on
contact,
Matte Tin
on tail
(7.25)
.285
–EGP
(5.30)
.209
(1.07)
.042
10 to 150 I/Os
(1.50 mm)
.059"
NOMINAL
WIPE
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
DV
OTHER
OPTION
TR
–L
= Latching
(Lead Style –05.0 only)
(N/A with –EGP or
–EGPS option)
– EGP
= Extended Guide Post
(Lead Style –07.0 only)
(N/A with –L & –EGPS option)
–EGPS
= Extended
Guide Post Shield
(Lead Style –07.0 only)
(N/A with –L & –EGP option)
(–010, –020, –025, –030 only)
–K
= (6.00 mm) .236" DIA
Polyimide Film
Pick & Place Pad
– TR
= Tape
& Reel
Packaging
(2.50)
.098
(6.20)
.244
Note: Patented
Note: Some lengths, styles
and options are non-standard,
(1.32)
.052
DIA
(0.80)
.0315
(5.40)
.213
(0.64)
.025
(0.94)
–L ^.037
non-returnable.
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
(7.20)
.283
–EGPS