BTH-030-01-L-D-A-K Datasheet, PDF (1/1 Pages) Samtec, Inc – BASIC BLADE & BEAM HEADER & SOCKET

F-211
BTH–030–01–L–D–A
TM
(0,50mm) .01969"
BTH, BSH SERIES
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles
BSH–090–01–L–D–A
BSH–060–01–F–D–A
BASIC BLADE & BEAM HEADER & SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTH or
www.samtec.com?BSH
Insulator Material:
LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
1.25A @ 80°C ambient
Flammability Rating:
UL 94 VO
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (030-090)
(0,15mm) .006" max (120-150)
Board Stacking:
For applications requiring
more than two connectors per
board or 90 positions or higher,
contact [e-mail]
BTH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
Mates with:
BSH
–030, –050, –060,
–090, –120, –150
No. of Positions x (0,50) .0197
01
+ (5,00) .197
(3,94)
.155
(5,97)
.235
02
(0,50)
.01969
(0,20)
.008
–F
= Gold Flash on contact, Matte Tin on tail
–L
= 10µ" (0,25µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50µ" (1,27µm) min Au over 150µ" (3,81µm)
Ni on Signal Pins in contact area,
10µ" (0,25µm) min Au over 50µ" (1,27µm)
Ni on Ground Plane in contact area,
Matte Tin over 50µ" (1,27µm) min
Ni on all solder tails
–K
= (7,00mm)
.276" DIA
Polyimide Film
Pick
& Place Pad
–TR
= Tape & Reel
(120 positions
maximum)
(4,27)
.168
(0,89)
.035
DIA
(0,76)
.030
• Passes
10 year MFG
MATED HEIGHT
LEAD
STYLE
MATED
HEIGHT*
– 01
(5,00) .197
*Processing conditions will
affect mated height.
APPLICATION
SPECIFIC
• 30µ" (0,76µm) Gold
• Edge Mount Capability
• 8mm, 11mm, 16 mm,
19mm and 22mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifications.)
(11mm, 16mm, 19mm and
22mm not available with 50
positions)
Call Samtec.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
BSH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
Mates with:
BTH
–030, –050, –060,
–090, –120, –150
(6,22)
.245
No. of Positions x (0,50) .0197
+ (6,27) .247
02
01
(0,50)
.01969
–F
= Gold Flash on contact, Matte Tin on tail
–L
= 10µ" (0,25µm) Gold on contact,
Matte Tin on tail
(3,81) (7,24)
.150 .285
– C*
= Electro-Polished Selective
50µ" (1,27µm) min Au over 150µ" (3,81µm)
Ni on Signal Pins in contact area,
10µ" (0,25µm) min Au over 50µ" (1,27µm)
Ni on Ground Plane in contact area,
Matte Tin over 50µ" (1,27µm) min
Ni on all solder tails
–TR
= Tape & Reel
(120 positions
maximum)
(3,05)
.120
(0,15)
.006
(3,25)
.128
(0,89)
.035
DIA
(0,76)
.030
AGILENT LOGIC
ANALYZER TEST POINT
CONNECTOR
Specify: ASP-65067-01
WWW.SAMTEC.COM