BTE-040-01-L-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – BASIC BLADE & BEAM HEADER & SOCKET

F-217
BSE–020–01–F–D–A
(0.80 mm) .0315"
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
BTE–040–02–L–D–A
BTE–060–02–F–D–A
BTE, BSE SERIES
BASIC BLADE & BEAM HEADER & SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTE or
www.samtec.com?BSE
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating: 2 A per pin
(1 pin powered per row)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating: 225 VAC with
5 mm Stack Height
Max Cycles: 100
RoHS Compliant: Yes
PROCESSING
Lead-Free Solderable: Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-080)
(0.15 mm) .006" max (100-120)
Board Stacking:
For applications requiring more
than two connectors per board
or 80 positions or higher,
contact [e-mail]
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
BTE
NO. OF POSITIONS
PER ROW
LEAD
STYLE
PLATING
OPTION
D
A
OTHER
OPTION
Mates with:
BSE
–020, –040, –060,
–080, –100, –120
No. of positions x (0.80) .0315
+ (4.00) .1575
01
(3.94)
.155
02
(0.80) .0315
(0.20)
.008
Specify
LEAD
STYLE
from
chart
(5.97)
.235
LEAD
STYLE
A
– 01
(4.27)
.168
–02
(7.21)
.284
(7.11)
.280
(0.76)
A ^.030
–F
= Gold Flash on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on
Signal Pins in contact area,
Matte Tin over 50 µ" (1.27 µm) min
Ni on all solder tails
*Note: –C Plating passes
10 year MFG testing
–K
= (7.00 mm)
.275" DIA
Polyimide
Film Pick
& Place Pad
– TR
= Tape & Reel
(60 positions
maximum)
(0.89)
.035
DIA
• Passes
10 year MFG
FILE NO. E111594
MATED HEIGHT
BSE
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
LEAD
STYLE
MATED
HEIGHT*
– 01
(5.00) .197
– 02
(8.00) .315
*Processing conditions will
affect mated height.
Mates with:
BTE
ALSO AVAILABLE
(MOQ Required)
• 30 µ" (0.76 µm) Gold
• Edge Mount Capability
• Friction Lock option
• 11 mm, 14 mm, 16.10 mm,
19.10 mm, 22 mm, 25 mm and
30 mm Stack Height (Caution:
Some automatic placement/
inspection machines may have
component height restrictions.
Please consult machinery
specifications.)
Contact Samtec.
Note: Some lengths, styles
and options are non-standard,
non-returnable.
02
(6.22)
.245
01
(3.05)
.120
–020, –040, –060,
–080, –100, –120
–F
= Gold Flash on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
– TR
= Tape & Reel
(80 positions
maximum)
No. of positions x (0.80) .0315
+ (5.27) .2075
(0.80) .0315
(0.15)
.006
(3.81) (7.24)
.150 .285
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal Pins in
contact area, Matte Tin over
50 µ" (1.27 µm) min Ni on all solder tails
*Note: –C Plating passes 10 year MFG testing
(3.25)
.128
(7.49)
.295
(1.78)
.070
(0.76)
.030
(0.89)
.035
DIA
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.