BSH-030-01-F-D-A Datasheet, PDF (1/1 Pages) Samtec, Inc – BASIC BLADE & BEAM HEADER

F-217
BTH–030–01–L–D–RA–WT
(0.50 mm) .0197"
10 YEAR MFG
WITH 50 µ" GOLD
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
BTH–090–01–F–D–A
BASIC BLADE & BEAM HEADER
BTH SERIES
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTH
Insulator Material: Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating: 2.0 A per pin
(1 pin powered per row)
Flammability Rating: UL 94 VO
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating: 275 VAC
Max Cycles: 100
RoHS Compliant: Yes
PROCESSING
Lead-Free Solderable: Yes
SMT Lead Coplanarity:
Vertical=
(0.10 mm) .004" max (030-090)
Vertical=
(0.15 mm) .006" max (120-150)
Right-angle=
(0.15 mm) .006" max (030-090)
Board Stacking:
For applications requiring more
than two connectors per board
or 90 positions or higher, contact
[e-mail]
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
BTH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
Mates with:
BSH
–030, –050, –060,
–090, –120, –150
No. of Positions x (0.50) .01969
01
+ (5.00) .197
(3.94)
.155
(5.97)
.235
02
(0.50)
.01969
(0.20)
.008
(0.76)
.030
(4.27)
.168
(0.89)
.035
DIA
–F
= Gold Flash on contact, Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm)
Ni on Signal Pins in contact area,
Matte Tin over 50 µ" (1.27 µm) min
Ni on all solder tails
*Note: –C Plating passes 10 year MFG testing
–K
= (7.00 mm)
.276" DIA
Polyimide Film
Pick
& Place Pad
–TR
= Tape & Reel
(120 positions
maximum)
• Passes
10 year MFG
BTH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
RA
WT
OTHER
OPTION
FILE NO. E111594
MATED HEIGHT
LEAD STYLE MATED HEIGHT*
– 01
(5.00) .197
*Processing conditions will
affect mated height.
Mates with:
BSH
–030, –060, –090
–F
= Gold Flash on contact,
Matte Tin on tail
ALSO AVAILABLE
(MOQ Required)
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
• 30 µ" (0.76 µm) Gold
• Edge Mount Capability
• 8 mm, 11 mm, 16 mm,
19 mm and 22 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may have
component height restrictions.
Please consult machinery
specifications.) (11 mm,
16 mm, 19 mm and 22 mm
not available with 50 positions)
Contact Samtec.
(9.78)
.385
01
(5.97)
.235
No. of Positions x (0.50) .01969 + (10.88) .428
(3.05)
.120
(0.71)
.028
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(1.32)
02
.052
DIA
(0.50)
.01969
(0.20)
.008
(1.32)
.052
x
(1.10)
.043
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
–K
= (7.00 mm) .276" DIA
Polyimide Film Pick
& Place Pad
(0.64)
.025
SQ