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K6F1616U6M Datasheet, PDF (4/9 Pages) Samsung semiconductor – 1M x 16 bit Super Low Power and Low Voltage Full CMOS Static RAM
K6F1616U6M Family
Preliminary
CMOS SRAM
RECOMMENDED DC OPERATING CONDITIONS1)
Item
Symbol
Supply voltage
Vcc
Ground
Vss
Input high voltage
VIH
Input low voltage
VIL
Note:
1. TA=-40 to 85°C, otherwise specified
2. Overshoot: VCC+2.0V in case of pulse width ≤20ns.
3. Undershoot: -2.0V in case of pulse width ≤20ns.
4. Overshoot and undershoot are sampled, not 100% tested.
Min
2.7
0
2.2
-0.23)
Typ
Max
Unit
3.0
3.3
V
0
0
V
-
Vcc+0.22)
V
-
0.6
V
CAPACITANCE1) (f=1MHz, TA=25°C)
Item
Input capacitance
Input/Output capacitance
1. Capacitance is sampled, not 100% tested
Symbol
CIN
CIO
Test Condition
VIN=0V
VIO=0V
Min
Max
Unit
-
8
pF
-
10
pF
DC AND OPERATING CHARACTERISTICS
Item
Input leakage current
Output leakage current
Average operating current
Output low voltage
Output high voltage
Standby Current (CMOS)
Symbol
Test Conditions
Min
ILI VIN=Vss to Vcc
-1
ILO CS1=VIH or CS2=VIL or OE=VIH or WE=VIL or LB=UB=VIH, -1
VIO=Vss to Vcc
ICC1 Cycle time=1µs, 100%duty, IIO=0mA, CS1≤0.2V, LB≤0.2V
-
or/and UB≤0.2V, CS2≥Vcc-0.2V, VIN≤0.2V or VIN≥VCC-0.2V
ICC2 Cycle time=Min, IIO=0mA, 100% duty, CS1=VIL,
CS2=VIH, LB=VIL or/and UB=VIL, VIN=VIL or VIH
70ns -
55ns -
VOL IOL = 2.1mA
-
VOH IOH = -1.0mA
2.4
Other input =0~Vcc
ISB1
1) CS1≥Vcc-0.2V, CS2≥Vcc-0.2V(CS1 controlled) or
2) 0V≤CS2≤0.2V(CS2 controlled) or
-
3) LB=UB≥Vcc-0.2V, CS2≥Vcc-0.2V(LB/UB controlled)
Typ1) Max
-
1
-
1
-
4
-
35
-
40
-
0.4
-
-
2.0 40
Unit
µA
µA
mA
mA
V
V
µA
1. Typical value are measured at VCC=3.0V, TA=25°C and not 100% tested.
4
Revision 0.1
November 2000