M368L1713CTL Datasheet, PDF (3/12 Pages) Samsung semiconductor – 128MB DDR SDRAM MODULE (16Mx64 based on 16Mx8 DDR SDRAM) Unbuffered 184pin DIMM 64-bit Non-ECC/Parity

M368L1713CTL
184pin Unbuffered DDR SDRAM MODULE
M368L1713CTL DDR SDRAM 184pin DIMM
16Mx64 DDR SDRAM 184pin DIMM based on 16Mx8
GENERAL DESCRIPTION
The Samsung M368L1713CTL is 16M bit x 64 Double Data
Rate SDRAM high density memory modules.
The Samsung M368L1713CTL consists of eight CMOS 16M x
8 bit with 4banks Double Data Rate SDRAMs in 66pin TSOP-
II(400mil) packages mounted on a 184pin glass-epoxy sub-
FEATURE
•Performance range
Part No.
Max Freq.
M368L1713CTL-C(L)B3 166MHz(6ns@CL=2.5)
M368L1713CTL-C(L)A2 133MHz(7.5ns@CL=2)
M368L1713CTL-C(L)B0 133MHz(7.5ns@CL=2.5)
Interface
SSTL_2
strate. Four 0.1uF decoupling capacitors are mounted on the
printed circuit board in parallel for each DDR SDRAM. The
M368L1713CTL is Dual In-line Memory Modules and intended
for mounting into 184pin edge connector sockets.
Synchronous design allows precise cycle control with the use
of system clock. Data I/O transactions are possible on both
edges of DQS. Range of operating frequencies, programmable
latencies and burst lengths allow the same device to be useful
for a variety of high bandwidth, high performance memory sys-
tem applications.
•Power supply : Vdd: 2.5V ± 0.2V, Vddq: 2.5V ± 0.2V
• Double-data-rate architecture; two data transfers per clock cycle
•Bidirectional data strobe(DQS)
•Differential clock inputs(CK and CK)
•DLL aligns DQ and DQS transition with CK transition
•Programmable Read latency 2, 2.5 (clock)
•Programmable Burst length (2, 4, 8)
•Programmable Burst type (sequential & interleave)
•Edge aligned data output, center aligned data input
•Auto & Self refresh, 15.6us refresh interval(4K/64ms refresh)
•Serial presence detect with EEPROM
•PCB :Height1250 mil, double sided component
PIN CONFIGURATIONS (Front side/back side)
Pin Front Pin Front Pin Front Pin Back
1 VREF 32 A5 62 VDDQ 93 VSS
2 DQ0 33 DQ24 63 /WE 94 DQ4
3 VSS 34 VSS 64 DQ41 95 DQ5
4 DQ1 35 DQ25 65 /CAS 96 VDDQ
5 DQS0 36 DQS3 66 VSS 97 DM0
6 DQ2 37 A4 67 DQS5 98 DQ6
7 VDD 38 VDD 68 DQ42 99 DQ7
8 DQ3 39 DQ26 69 DQ43 100 VSS
9 NC 40 DQ27 70 VDD 101 NC
10 NC 41 A2 71 */CS2 102 NC
11 VSS 42 VSS 72 DQ48 103 NC
12 DQ8 43 A1 73 DQ49 104 VDDQ
13 DQ9 44 *CB0 74 VSS 105 DQ12
14 DQS1 45 *CB1 75 /CK2 106 DQ13
15 VDDQ 46 VDD 76 CK2 107 DM1
16 CK1 47 *DQS8 77 VDDQ 108 VDD
17 /CK1 48 A0 78 DQS6 109 DQ14
18 VSS 49 *CB2 79 DQ50 110 DQ15
19 DQ10 50 VSS 80 DQ51 111 *CKE1
20 DQ11 51 *CB3 81 VSS 112 VDDQ
21 CKE0 52 BA1 82 VDDID 113 *BA2
22 VDDQ
KEY 83 DQ56 114 DQ20
23 DQ16 53 DQ32 84 DQ57 115 *A12
24 DQ17 54 VDDQ 85 VDD 116 VSS
25 DQS2 55 DQ33 86 DQS7 117 DQ21
26 VSS 56 DQS4 87 DQ58 118 A11
27 A9 57 DQ34 88 DQ59 119 DM2
28 DQ18 58 VSS 89 VSS 120 VDD
29 A7 59 BA0 90 NC 121 DQ22
30 VDDQ 60 DQ35 91 SDA 122 A8
31 DQ19 61 DQ40 92 SCL 123 DQ23
Pin Back
124 VSS
125 A6
126 DQ28
127 DQ29
128 VDDQ
129 DM3
130 A3
131 DQ30
132 VSS
133 DQ31
134 *CB4
135 *CB5
136 VDDQ
137 CK0
138 /CK0
139 VSS
140 *DM8
141 A10
142 *CB6
143 VDDQ
144 *CB7
KEY
145 VSS
146 DQ36
147 DQ37
148 VDD
149 DM4
150 DQ38
151 DQ39
152 VSS
153 DQ44
Pin Back
154 /RAS
155 DQ45
156 VDDQ
157 /CS0
158 */CS1
159 DM5
160 VSS
161 DQ46
162 DQ47
163 */CS3
164 VDDQ
165 DQ52
166 DQ53
167 *A13
168 VDD
169 DM6
170 DQ54
171 DQ55
172 VDDQ
173 NC
174 DQ60
175 DQ61
176 VSS
177 DM7
178 DQ62
179 DQ63
180 VDDQ
181 SA0
182 SA1
183 SA2
184 VDDSPD
PIN DESCRIPTION
Pin Name
Function
A0 ~ A11
Address input (Multiplexed)
BA0 ~ BA1
Bank Select Address
DQ0 ~ DQ63
Data input/output
DQS0 ~ DQS7
Data Strobe input/output
CK0,CK0 ~ CK2,CK2 Clock input
CKE0
Clock enable input
/CS0
Chip select input
RAS
Row address strobe
CAS
Column address strobe
WE
Write enable
DM0 ~ DM7
Data - in mask
VDD
Power supply (2.5V)
VDDQ
Power Supply for DQ S(2.5V)
VSS
Ground
VREF
Power supply for reference
VDDSPD
Serial EEPROM Power
Supply (2.3V to 3.6V)
SDA
Serial data I/O
SCL
Serial clock
SA0 ~ 2
Address in EEPROM
VDDID
VDD identification flag
NC
No connection
* These pins are not used in this module.
SAMSUNG ELECTRONICS CO., Ltd. reserves the right to change products and specifications without notice.
Rev. 0.3 May. 2002