K4Y54084UF-JC Datasheet, PDF (2/3 Pages) Samsung semiconductor – XDRTM DRAM Product Guide

General Information
XDR^TM DRAM
A. XDR DRAM Ordering Information
12 3
4
5
6 78
9 10
11
K4 YXXXXXXX-XXXX
SAMSUNG Memory
DRAM
Product
Density & Refresh
Organization
Speed
Temperature & Power
Package Type
Revision
Interface (VDD)
Bank
1. SAMSUNG Memory : K
2. DRAM : 4
3. Product
Y : XDR DRAM
4. Density & Refresh
54 : 256M, 16K/16ms(0.98us)
50 : 512M, 32K/16ms(0.49us)
8. Revision
M : 1st Gen.
C : 4th Gen.
E : 6th Gen.
F : 7th Gen.
9. Package Type
J : BOC lead free
5. Organization
02 : x2
04 : x4
08 : x8
16 : x16
6. Bank
4 : 8 Banks
7. Interface ( VDD, VDDQ)
U : DRSL(1.8V,1.2V )
10. Temperature & Power
C : Commercial, Normal Power
11. Speed (Data frequency, t_RAC, t_RC)
DS : for Daisy chain Sample
A2 : 2.4Gbps, 36ns, 16cycles
B3 : 3.2Gbps, 35ns, 20cycles
C3 : 3.2Gbps, 35ns, 24cycles
C4 : 4.0Gbps, 28ns , 24cycles