CL10B474KO8NNNC Datasheet, PDF (19/21 Pages) Samsung semiconductor – General Multilayer Ceramic Capacitors

▶ Bending Stress
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the
board. When the MLCCs are mounted onto the other side,
it is important to support the board as shown in the illustration. If the circuit board is not supported,
the crack occur to the ready-installed MLCCs by the bending stress.
nozzle
force
support pin
▶ Manual Soldering
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors.
The hot soldering iron tip comes into direct contact with the end terminations, and operator's
carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic
body of the capacitor.
Therefore the soldering iron must be handled carefully, and close attention must be paid
to the selection of the soldering iron tip and to temperature control of the tip.
▶ Amount of Solder
Too much
Solde r
Not enough
Solde r
Goo d
C racks tend to occur due
to larg e stress
W eak hold ing forc e m ay
cause bad conne ctions or
detach ing of the capacitor