K7I323682M Datasheet, PDF (1/17 Pages) Samsung semiconductor – 1Mx36 & 2Mx18 DDRII CIO b2 SRAM

K7I323682M
K7I321882M
1Mx36 & 2Mx18 DDRII CIO b2 SRAM
Document Title
1Mx36-bit, 2Mx18-bit DDRII CIO b2 SRAM
Revision History
Rev. No.
History
Draft Date
0.0
1. Initial document.
0.1
1. Pin name change from DLL to Doff.
2. Vddq range change from 1.5V to 1.5V~1.8V.
October, 22 2001
December, 12 2001
3. Update JTAG test conditions.
4. Reserved pin for high density name change from NC to Vss/SA
5. Delete AC test condition about Clock Input timing Reference Level
6. Delete clock description on page 2 and add HSTL I/O comment
0.2
1. Update current characteristics in DC electrical characteristics
July, 29. 2002
2. Change AC timing characteristics
3. Update JTAG instruction coding and diagrams
0.3
1. Add AC electrical characteristics.
2. Change AC timing characteristics.
Sep. 6. 2002
3. Change DC electrical characteristics(ISB1)
0.4
1. Change the data Setup/Hold time.
2. Change the Access Time.(tCHQV, tCHQX, etc.)
Oct. 7. 2002
3. Change the Clock Cycle Time.(MAX value of tKHKH)
4. Change the JTAG instruction coding.
0.5
1. Change the Boundary scan exit order.
2. Change the AC timing characteristics(-25, -20)
Dec. 16, 2002
3. Correct the Overshoot and Undershoot timing diagrams.
0.6
1. Correct the JTAG ID register definition
Mar. 20, 2003
2. Correct the AC timing parameter (delete the tKHKH Max value)
0.7
1. Change the Maximum Clock cycle time.
2. Correct the 165FBGA package ball size.
April. 4, 2003
0.8
1. Change the operating current parameter.
before after
Oct. 29, 2003
Icc(x36) -25 : 620
700
-20 : 520
600
-16 : 440
500
Icc(x18) -25 : 560
670
-20 : 470
570
-16 : 410
470
Icc(x 8 ) -25 : 540
650
-20 : 450
550
-16 : 390
450
Isb1
-25 : 200
230
-20 : 180
200
-16 : 160
190
1.0
1. Final spec release
2.0
1. Delete the x8 Org. part
2.1
1. Change the operating current parameter
before after
Isb1
-25 : 230
250
-20 : 200
230
-16 : 190
220
Oct. 31, 2003
Dec. 1, 2003
July. 27, 2004
Remark
Advance
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Final
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
July. 2004
Rev 2.1