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CL31C332FBFNNNE Datasheet, PDF (1/2 Pages) Samsung semiconductor – Multi-layer Ceramic Capacitor | |||
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SPECIFICATION
⢠Supplier : Samsung electro-mechanics
⢠Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
⢠Samsung P/N : CL31C332FBFNNNE
⢠Description : CAP, 3.3ã, 50V, ±1%, C0G, 1206
CL 31 C 332 F B F N N N E
â ⡠⢠⣠⤠⥠â¦â§â¨â©âª
â Series
â¡ Size
Samsung Multi-layer Ceramic Capacitor
1206 (inch code)
L: 3.2 ± 0.15 mm
W: 1.6 ± 0.15 mm
⢠Dielectric
⣠Capacitance
⤠Capacitance
tolerance
⥠Rated Voltage
⦠Thickness
C0G
3.3 ã
±1 %
50 V
1.25 ± 0.15 mm
⧠Inner electrode
Termination
Plating
⨠Product
â© Special
⪠Packaging
Ni
Cu
Sn 100% (Pb Free)
Normal
Reserved for future use
Embossed Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance
Q
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characterisitcs
Adhesive Strength
of Termination
Bending Strength
Solderability
Performance
Test condition
Within specified tolerance
1ã±10%
0.5~5Vrms
1000 min
10,000Mohm or 500Mohmâ
ã
Rated Voltage 60~120 sec.
Whichever is Smaller
No abnormal exterior appearance
Microscope (Ã10)
No dielectric breakdown or
300% of the rated voltage
mechanical breakdown
C0G
(From -55â to 125â, Capacitance change shoud be within ±30PPM/â)
No peeling shall be occur on the
500gâ
F, for 10±1 sec.
terminal electrode
Capacitance change :
Bending to the limit (1mm)
within ±5% or ±0.5ã whichever is larger with 1.0mm/sec.
More than 75% of terminal surface
SnAg3.0Cu0.5 solder
is to be soldered newly
245±5â, 3±0.3sec.
(preheating : 80~120â for 10~30sec.)
Resistance to
Soldering heat
Capacitance change :
Solder pot : 270±5â, 10±1sec.
within ±2.5% or ±0.25ã whichever is larger
Tan δ, IR : initial spec.
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