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CL31B475KOHNNNE Datasheet, PDF (1/2 Pages) Samsung semiconductor – CAP, 4.7㎌, 16V, ±10%, X7R, 1206 | |||
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SPECIFICATION
⢠Supplier : Samsung electro-mechanics
⢠Product : Multi-layer Ceramic Capacitor
⢠Samsung P/N : CL31B475KOHNNNE
⢠Description : CAP, 4.7ã, 16V, ±10%, X7R, 1206
A. Samsung Part Number
CL 31 B 475 K O H N N N E
â â¡â¢ ⣠â¤â¥â¦â§â¨â©âª
â Series
â¡ Size
Samsung Multi-layer Ceramic Capacitor
1206 (inch code)
L: 3.2 ± 0.15 mm
W: 1.6 ± 0.15 mm
⢠Dielectric
⣠Capacitance
⤠Capacitance
tolerance
⥠Rated Voltage
⦠Thickness
X7R
4.7 ã
±10 %
16 V
1.6 ± 0.2 mm
⧠Inner electrode
Termination
Plating
⨠Product
â© Special
⪠Packaging
Ni
Cu
Sn 100% (Pb Free)
Normal
Reserved for future use
Embossed Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance
Tan δ (DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characterisitcs
Adhesive Strength
of Termination
Bending Strength
Solderability
Resistance to
Soldering heat
Performance
Test condition
Within specified tolerance
1ã±10%
1.0±0.2Vrms
0.1 max.
10,000Mohm or 100Mohmâ
ã
Rated Voltage 60~120 sec.
Whichever is Smaller
No abnormal exterior appearance
Microscope (Ã10)
No dielectric breakdown or
250% of the rated voltage
mechanical breakdown
X7R
(From -55â to 125â, Capacitance change shoud be within ±15%)
No peeling shall be occur on the
500gâ
F, for 10±1 sec.
terminal electrode
Capacitance change : within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
More than 75% of terminal surface
1) Sn63Pb37 solder
is to be soldered newly
235±5â, 5±0.5sec.
2) SnAg3.0Cu0.5 solder
245±5â, 3±0.3sec.
(preheating : 80~120â for 10~30sec.)
Capacitance change : within ±7.5% Solder pot : 270±5â, 10±1sec.
Tan δ, IR : initial spec.
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