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CL21F105ZBFNNNE Datasheet, PDF (1/2 Pages) Samsung semiconductor – CAP, 1㎌, -20+80%, 50V, Y5V, 0805 | |||
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SPECIFICATION
⢠Supplier : Samsung electro-mechanics
⢠Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
⢠Samsung P/N : CL21F105ZBFNNNE
⢠Descriptiont : CAP, 1ã, -20+80%, 50V, Y5V, 0805
CL 21 F 105 Z B F N N N E
â â¡â¢ ⣠â¤â¥â¦â§â¨â©âª
â Series
â¡ Size
Samsung Multi-layer Ceramic Capacitor
0805 (inch code)
L: 2.0 ± 0.1 mm
W: 1.25 ± 0.1 mm
⢠Dielectric
⣠Capacitance
⤠Capacitance
tolerance
⥠Rated Voltage
⦠Thickness
Y5V
1ã
-20/+80 %
50 V
1.25 ± 0.1 mm
⧠Inner electrode
Termination
Plating
⨠Product
â© Special
⪠Packaging
Ni
Cu
Sn 100% (Pb Free)
Normal
Reserved for future use
Embossed Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance
Tan δ (DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characterisitcs
Adhesive Strength
of Termination
Bending Strength
Solderability
Performance
Test condition
Within specified tolerance
1ã±10%
1.0±0.2Vrms
0.07 max.
10,000Mohm or 100Mohmâ
ã
Rated Voltage 60~120 sec.
Whichever is Smaller
No abnormal exterior appearance
Microscope (Ã10)
No dielectric breakdown or
250% of the rated voltage
mechanical breakdown
Y5V
(From -30â to 85â, Capacitance change shoud be within -82~+22%)
No peeling shall be occur on the
500gâ
F, for 10±1 sec.
terminal electrode
Capacitance change : within ±30% Bending to the limit (1mm)
with 1.0mm/sec.
More than 75% of terminal surface
SnAg3.0Cu0.5 solder
is to be soldered newly
245±5â, 3±0.3sec.
(preheating : 80~120â for 10~30sec.)
Resistance to
Soldering heat
Capacitance change : within ±20%
Tan δ, IR : initial spec.
Solder pot : 270±5â, 10±1sec.
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