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CL21A106KQCLNNC Datasheet, PDF (1/2 Pages) Samsung semiconductor – SPECIFICATION | |||
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SPECIFICATION
⢠Supplier : Samsung electro-mechanics
⢠Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
⢠Samsung P/N : CL21A106KQCLNNC
⢠Description : CAP, 10ã, ±10%, 6.3V, X5R, 0805
CL 21 A 106 K Q C L N N C
â â¡â¢ ⣠â¤â¥â¦â§â¨â©âª
â Series
â¡ Size
⢠Dielectric
⣠Capacitance
⤠Capacitance
tolerance
⥠Rated Voltage
⦠Thickness
Samsung Multi-layer Ceramic Capacitor
0805 (inch code)
L: 2.0 ± 0.1 mm
W: 1.25 ± 0.1 mm
⧠Thickness division Low profile
X5R
Inner electrode
Ni
10 ã
Termination
Cu
±10 %
Plating
Sn 100% (Pb Free)
⨠Product
Normal
6.3 V
â© Special
Reserved for future use
0.85 ± 0.1 mm
⪠Packaging
Cardboard Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance
Tan δ (DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characterisitcs
Adhesive Strength
of Termination
Bending Strength
Solderability
Performance
Test condition
Within specified tolerance
1ã±10%
1.0±0.2Vrms
0.1 max.
10,000Mohm or 100Mohmâ
ã
Rated Voltage 60~120 sec.
Whichever is Smaller
No abnormal exterior appearance
Microscope (Ã10)
No dielectric breakdown or
250% of the rated voltage
mechanical breakdown
X5R
(From -55â to 85â, Capacitance change shoud be within ±15%)
No peeling shall be occur on the
500gâ
F, for 10±1 sec.
terminal electrode
Capacitance change : within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
More than 75% of terminal surface
SnAg3.0Cu0.5 solder
is to be soldered newly
245±5â, 3±0.3sec.
(preheating : 80~120â for 10~30sec.)
Resistance to
Soldering heat
Capacitance change : within ±7.5% Solder pot : 270±5â, 10±1sec.
Tan δ, IR : initial spec.
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