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CIM10J102NC Datasheet, PDF (1/5 Pages) Samsung semiconductor – Chip Bead For EMI Suppression | |||
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Chip Bead For EMI Suppression
201208
CIB/CIM10 Series (1608/ EIA 0603)
APPLICATION
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
FEATURES
ï Perfect shape for automatic mounting, with no directionality.
ï Excellent solderability and high heat resistance for either flow or
reflow soldering
ï Monolithic inorganic material construction for high reliability
ï Closed magnetic circuit configuration avoids crosstalk and is
suitable for high density PCBs.
DIMENSION
RECOMMENDED LAND PATTERN
0.6~0.8mm
0.6~0.8mm
0.6~0.8mm
0.6~0.8mm
Type
Dimension [mm]
L
W
t
d
10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2
DESCRIPTION
Part no.
CIB10P100
CIB10P220
CIB10P260
CIB10P300
CIB10P330
CIM10U800
CIM10U121
CIM10U221
CIM10U241
CIM10U301
CIM10U471
CIM10U601
CIM10U102
CIM10U202
CIB10J300
CIM10J400
CIM10J470
CIM10J600
CIM10J750
CIM10J800
CIM10J121
CIM10J151
CIM10J221
CIM10J241
Thickness
(mm)
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
0.8±0.15
Impedance
(â¦)±25%@100MHz
10
22
26
30
33
80
120
220
240
300
470
600
1000
2000(at 70MHz)
30
40
47
60
75
80
120
150
220
240
DC Resistance
(â¦) Max.
0.05
0.05
0.08
0.08
0.08
0.10
0.15
0.25
0.25
0.30
0.35
0.38
0.50
1.20
0.10
0.12
0.12
0.12
0.15
0.15
0.20
0.20
0.30
0.30
Rated Current
(mA) Max.
1000
1500
1000
1000
1000
600
500
400
400
400
300
500
400
200
1000
600
600
600
550
550
500
400
400
400
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