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CIG22L1R0MNE Datasheet, PDF (1/31 Pages) Samsung semiconductor – MULTILAYER CHIP COMPONENTS
Passive components Sales Office
Head Office
206, Cheomdansaneop Road,
Youngtong-gu,
Suwon, Kyonggi Province 443-743,
Korea
Europe
Te l:+82-31-210 -6328
E-mail : james.pyun@samsung.com
America
Te l:+82-31-210 -6794
E-mail : randy.kim@samsung.com
Asia
Te l:+82-31-210 -5348
E-mail : koogi@samsung.com
Domestic
Te l:+82-31-210 -3757
E-mail : southjoy@samsung.com
Manufacturing Site
Suwon Plant
206 Cheomdansaneop Road,
Youngtong- gu,
Suwon, Kyonggi Province 443-743,
Korea
Te l:+82-31-210-6794
E-mail : randy.kim@samsung.com
Busan Plant
1623-2, Songjeong-dong,
Kangseo-gu, Busan 618-270, Korea
Te l:+82-51-970-7671
E-mail : kyc.kweon@samsung.com
Tianjin Plant
27, Heiniucheng-Road, Hexi District,
Tianjin, China 300210
Te l:+86-22-2830-3333(3450)
E-mail : gk.ryu@samsung.com
Philippines Plant
Calamba Premiere International Park,
Batino, Calamba, Laguna, Manila
Te l:+63-2-809-2873
E-mail : ksj1445@samsung.com
Asia sales office
Shanghai Office
Rm 1408 Shanghai international
trade center No 2200 Yan an(W) RD
Shanghai China 200335
Te l:86-21-6270-4168(274)
E-mail : dennis.cha@samsung.com
Shenzhen Office
Rm 4501, 45 /F, New World Center,
Yitian Road, Futian District,
Shenzhen, China 518026
Te l:86-755-8608-5581
E-mail : jackson.xian@samsung.com
Qingdao Office
Rm 1201. Growne Plaza Qingdao;
76XiangGangZhong Rd, Qingdao;266071
P.R. China
Te l:86-532-5779102
E-mail : zhengguo.cui@samsung.com
HongKong Office
Suite 4511, Two int’l Finance Centre,
8 Finance Street, Central, Hongkong
Te l:852-2862-6350
E-mail : vinsent.chou@samsung.com
Singapore Office
3 Church Street Samsung Hub
#23-02 Singapore 049483
Te l:(65)6833-3228
E-mail : winson.yeong@samsung.com
Thai Office
Wellgrow Industrial Estate,
93 Moo 5 T. Bangsamak, A.Bangpakong
Chachoengsao 24180 Thailand
Te l:66-38-562-026
E-mail : sbimm@samsung.com
America sales office
Irvine Office
92612 3345 Michelson Drive,
Suite 350,Irvine, CA
Te l:1-949-797-8047
E-mail : sh386.kim@samsung.com
Europe sales office
Frankfurt Office
Samsung haus
Am Kronberger Hang 6
D-65824 Schwalbach/Ts.
Te l:49-6196-66-7255
FAX:49-(0)6196-66-7755
E-mail : frank.goebel@samsung.com
Hungary Office
H2310, Szigetszentmiklos, Leshegy u.
2-4, Hungary
Te l:36-24-551-148
E-mail : jun21c.lee@samsung.com
Domestic Distributors
KORCHIP INC
#219-8 Gasan-dong, Gumchun-gu,
Seoul, Korea
Te l:+82-2-838-5588
E-mail : hjh0064@korchip.com
CHUNG HAN
#16-96 Hangang-lo 3, Youngsan-Gu,
Seoul, Korea
Te l:+82-2-718-3322
E-mail : bu1230choi@hanmail.net
SAMT
Daekyung Bldg.,Daechi-Dong,
Gangnam-Gu, Seoul, Korea
Te l:+82-2-3458-9000
E-mail : info@isamt.com
Taiwan Office
399 9F-1, Ruey Kuang Rd., Neihu,
Taipei, Taiwan
Te l:886-2-2656-8356
E-mail : kevin0130.wang@samsung.com
CHUNGMAC
#53-5 Wonhyolo3 Youngsan-gu,
Seoul, Korea
Te l:+82-2-716-6428~9
E-mail : webmaster@anycam.co.kr
APEXINT
Room #905.
C-dong
Woorimlion,s,
Valley 371-28, Gasan-dong,
Guemcheon-Gu, Seoul, Korea
Te l:+82-2-2026-2610(2)
E-mail : info@apexint.co.kr
All information indicated in this catalog is as of october. 2008
The specifications and designs contained herein may be subject to change without notice.
October 2008
MULTILAYER
CHIP COMPONENTS
CHIP INDUCTOR / BEADS
EMI /ESD PRODUCTS
PRODUCTS for
COMMUNICATION EQUIPMENT