LED800 Datasheet, PDF (8/8 Pages) Roithner LaserTechnik GmbH – Infrared LED

Recommended Land Layout (Unit: mm)
3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• DO NOT apply any stress to the lead particularly when heat.
• The LEDs must not be reposition after soldering.
• After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
• When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
• Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
Soldering Conditions
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
21.11.2011
LED800-series
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