H-HP803-XX Datasheet, PDF (6/6 Pages) Roithner LaserTechnik GmbH – 3W Hexagon Power LED Series

Reliability Test Items and Conditions
No.
Item
Test Conditions
Test time Ac⁄Re
1
Solder Heat
260±5C
5 sec
0⁄1
-40C
25C
105C
25C
2
Temperature Cycle
100cycle 0⁄1
30 min 5 min 30 min 5 min
3
Thermal Shock
-40C
5 min
105C
5 min
20 cycle
0⁄1
4
High Temperature Storage
85C
1000 hrs
0⁄1
5
Low Temperature Storage
-35C
1000 hrs
0⁄1
6
DC Operating Life
I_F 700mA
1000 hrs 0⁄1
7
High Temperature⁄High Humidity
Ta 60C R.H 90 .
1000 hrs 0⁄1
Forward Voltage Vf
Vf_max Increase <1.2x
Judgment Criteria
Reverse Current I_R
I_{R max} Increase <2x
Luminous Intensity Flux
Iv Decay < 50%
Note Measurement shall be taken after the tested samples have been returned to normal ambient conditions.
Soldering heat reliability DIP Please refer to the following figure
Soldering heat 260¢ JMax.
245¡ 5Ó¢ Jwithin 5 sec
¢J
Preheat
ROITHNER LASERTECHNIK, A-1040 Vienna, Austria, Wiedner Hauptstrasse 76, Top 9/1
Tel.: [phone] - 0, Fax.: [phone]
e-mail: [e-mail]
http://www.roithner-laser.com