O5CA5111P Datasheet, PDF (4/4 Pages) Roithner LaserTechnik GmbH – Visible LED 5 mm

Precaution for Use
1. Cautions
• DO NOT look directly into the light or look through the optical system.
2. Lead Forming
• When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
• Lead forming should be done before soldering.
• DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• Recommended soldering conditions:
Dip Soldering
Pre-Heat
120 °C Max.
Pre-Heat Time
60 Seconds Max.
Solder Bath Temperature
260 °C Max.
Dipping Time
5 Seconds Max.
Dipping Position
No lower than 3 mm from the base of the epoxy bulb
• DO NOT apply any stress to the lead particularly when heat.
• The LEDs must not be reposition after soldering.
• After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
• When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
• Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
5. Heat Generation
• The powered LEDs generate heat. Heat dissipation should be considered in the application
design to avoid the environmental conditions for operation in excess of the absolute
maximum ratings.
28.04.2010
O5CA5111P
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